“…Lastly, it was found that since 2015, the scientific focus on CMP and more marginally represented semiconductor applications has grown significantly, such as copper-clad laminate (Kim et al 2017), physical vapour deposition (Chen et al 2020), laser chip manufacturing (Hou et al 2019), roll-to-roll manufacturing (Jin, Shui, and Shpitalni 2019;Shui, Jin, and Ni 2019), and wafer sawing (Hsieh et al 2020) among others. This clearly emphasises the future opportunities for VM in new, less studied semiconductor applications.…”