2019
DOI: 10.1016/j.cirp.2019.04.108
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Virtual sensing and virtual metrology for spatial error monitoring of roll-to-roll manufacturing systems

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Cited by 8 publications
(1 citation statement)
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“…Lastly, it was found that since 2015, the scientific focus on CMP and more marginally represented semiconductor applications has grown significantly, such as copper-clad laminate (Kim et al 2017), physical vapour deposition (Chen et al 2020), laser chip manufacturing (Hou et al 2019), roll-to-roll manufacturing (Jin, Shui, and Shpitalni 2019;Shui, Jin, and Ni 2019), and wafer sawing (Hsieh et al 2020) among others. This clearly emphasises the future opportunities for VM in new, less studied semiconductor applications.…”
Section: Semiconductor Manufacturingmentioning
confidence: 99%
“…Lastly, it was found that since 2015, the scientific focus on CMP and more marginally represented semiconductor applications has grown significantly, such as copper-clad laminate (Kim et al 2017), physical vapour deposition (Chen et al 2020), laser chip manufacturing (Hou et al 2019), roll-to-roll manufacturing (Jin, Shui, and Shpitalni 2019;Shui, Jin, and Ni 2019), and wafer sawing (Hsieh et al 2020) among others. This clearly emphasises the future opportunities for VM in new, less studied semiconductor applications.…”
Section: Semiconductor Manufacturingmentioning
confidence: 99%