Viscoelastic Analysis of Adhesively Bonded Joints

Delale, F.; Erdoğan, F.

doi:10.1115/1.3157618

Cited by 85 publications

(17 citation statements)

References 2 publications

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“…Hence, the problem becomes considerably simpler. The elastic results for this case have been given in [12] and are recovered numerically from the present formulation by selecting the same material constants for the adherends and a very small constant for (h,-h 2 )/h 1 • -10-…”

Section: General Solutionmentioning

confidence: 99%

“…In both cases the problem is reduced to a system of nonlinear differential equations. The questions to be resolved in this regard, however, are (a) whether the lengthy and tedious effort necessary to solve the complicated nonlinear problem is justified for the type of structural problems under consideration, and (b) whether a linear (or linearized) rheological behavior of the adhesive would not be a more important factor than the nonlinear elastic behavior affecting the stress distribution and failure in bonded structures [12].…”

Section: Introductionmentioning

confidence: 99%

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Stresses in adhesively bonded joints: a closed-form solution

1982

Composites

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In this paper the general plane strain problem of adhesively bonded structures which consist of two different orthotropic adherends ;s considered. Assuming that the thicknesses of the adherends are constant and are small in relation to the lateral dimensions of the bonded region, the adherends are treated as plates. Also, assuming that the thickness of the adhesive is small compared to that of the adherends, the thickness variation of the stresses in the adhesive layer is neglected. However, the transverse shear effects in the adherends and the in-plane normal strain in the adhesive are taken into account. The problem is reduced to a system of differential equations for the adhesive stresses which is solved ;n closed form. A single lap joint and a stiffened plate under various loading conditions are considered as examples. To verify the basic trend of the solutions obtained from the plate theory and to give some idea about the validity of the plate assumption itself, a sample problem is solved by using the finite element method and by treating the adherends and the adhesive as elastic continua. It is found that the plate theory used in the analysis not only predicts the correct trend for the adhesive stresses but also gives rather surprisingly accurate results. The solution is obtained by assuming linear stress-strain relations for the adhesive. In the Appendix the problem is formulated by using a nonlinear material for the adhesive and by following two different approaches.

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Section: General Solutionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Stresses in adhesively bonded joints: a closed-form solution

1982

Composites

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“…For constanttemperature the basicformulation of the adhesively bondedjointswas considered in a previouspaper [5] where it was assumed thatthe adhesiveis a linearviscoelastic materialwhichcan be modeled by usingdifferential operators. In this paperthe hereditary integrals will be usedto model the adhesiveand the solutionwill be givenfor varioustemperatures in orderto give some idea aboutthe relative importance of the temperature changesor of the operating temperatures.…”

Section: Formulation Of the Problemmentioning

confidence: 99%

“…However,they can easilybe expressed in termsof real integrals and can be evaluated numerically [5]. The relaxation modulusof the adhesive is obtainedfrom a torsionrelaxation test.…”

Section: Formulation Of the Problemmentioning

confidence: 99%

Time-Temperature Effect in Adhesively Bonded Joints

Delale

1981

Journal of Composite Materials

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In this paper the viscoelastic analysis of an adhesively bonded lap joint is reconsidered. The adherends are approximated by essentially Reissner plates and the adhesive is assumed to be linearly viscoelastic. The hereditary in tegrals are used to model the adhesive. The problem is reduced to a system of linear integral-differential equations for the shear and the tensile stress in the adhesive. For a constant operating temperature, the equations are shown to have constant coefficients and are solved by using Laplace transforms. It is also shown that if the temperature variation in time can be approximated by a piecewise constant function, then the method of Laplace transforms could still be used to solve the problem. A numerical example is given for a single lap joint under various loading conditions and operating at temperatures 70, 100, 140 and 180°F.

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“…Weitsman 6) analyzed the mechanical behavior of an epoxy adhesive layer as the adhesive absorbs moisture from the ambient environment. Delale and Erdogan 7) presented the viscoelastic behavior of an adhesively bonded lap joint. Lee 8) performed the boundary element analysis of the stress singularity for the viscoelastic adhesive layer under transverse tensile strain.…”

Section: Introductionmentioning

confidence: 99%

Stress Analysis in Polymeric Coating Layer Deposited on Rigid Substrate

Lee¹

2015

Corrosion Science and Technology

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This paper presents an analysis of thermal stress induced along the interface between a polymeric coating layer and a steel substrate as a result of uniform temperature change. The epoxy layer is assumed to be a linear viscoelastic material and to be theromorheologically simple. The viscoelastic boundary element method is employed to investigate the behavior of interface stresses. The numerical results exhibit relaxation of interface stresses and large stress gradients, which are observed in the vicinity of the free surface. Since the exceedingly large stresses cannot be borne by the polymeric coating layer, local cracking or delamination can occur at the interface corner.

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Viscoelastic Analysis of Adhesively Bonded Joints

Cited by 85 publications

References 2 publications

Stresses in adhesively bonded joints: a closed-form solution

Stresses in adhesively bonded joints: a closed-form solution

Time-Temperature Effect in Adhesively Bonded Joints

Stress Analysis in Polymeric Coating Layer Deposited on Rigid Substrate

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