“…Ball milling method, used in this work, it is a low cost procedure, which avoid chemical contamination and can be easily implemented to produce large amounts of material. It has been successfully applied to many other semiconductor materials, like Si [8,9], Ge [10,11], ZnO [12], GaSb [13] or CdSe [14]. However, the mechanical damage induced during milling and, in some cases, the formation of oxides are drawbacks of this method.…”