Aqueous chemicals and solvents are used heavily in semiconductor manufacturing, and device manufacturers are focused on advancing these cleaning liquids to the next technology node. The scientific results confirm that ultrasonic agitation can improve the removal of particles. Megasonic energy has been proven to improve particle elimination in semiconductor devices in cleaning procedures. On the other hand, applied ultrasonic energy may damage the sensible devices in the cleaning process. In order to better comprehend, we explore in this paper the impact of different liquid properties by showing the transient cavitation threshold by performing some simulations with the analytical Blake model and the numerical Gilmore model. The experimental setup firstly to understand the temporal and spectral response of the increasing of the electrical power, and secondly to investigate that increasing the gas level in the cleaning bath in Water-1MHz-gasified with O_2 modifies the acoustical pressure in the medium. We can conclude that the experimental measurements and simulation studies of the applicable sound wave field and cavitation level provide an important indication of the medium's properties. By proceeding in this manner, we can find the impact parameters on the onset of transient cavitation and the safe area to treat client wafers. At this point, we can figure out the cavitation threshold that works for us and safely translate it from one chemical process to another.