Visualization study of a flat confined loop heat pipe for electronic devices cooling

Xl, Wang; Yang, Jingxuan; Wen, Qiaowei; Shittu, Samson; Qiu, Zining; Zhao, Xudong; Wang, Zhangyuan

doi:10.1016/j.apenergy.2022.119451

Cited by 27 publications

(6 citation statements)

References 36 publications

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“…Heat production in electronics is characterized by heat concentration [6], limited heat dissipation area, multiple application conditions [7], complex and variable environments, interdisciplinarity [8], and multi-physical field coupling [9]. At present, the commonly used approaches in the area of electronics thermal management include air cooling [7], thermoelectric cooling [10][11][12][13], immersed liquid cooling, phase-change cooling, heat pipe [14][15][16], spray cooling and microchannel cooling [17]. The heat dissipation capacities of these common cooling methods under normal circumstances are shown in figure 2.…”

Section: Introductionmentioning

confidence: 99%

“…The heat dissipation capacities of these common cooling methods under normal circumstances are shown in figure 2. With the rapid development of electronic technology, the heat flux generated by the new generation of microelectronic devices has reached 1500 W•cm −2 [10,11,14], while the maximum heat flux dissipated by the air-cooling system is about 100 W•cm −2 [7]. It means that the air-cooling approach can no longer meet the current and future high heat flux dissipation requirements.…”

Section: Introductionmentioning

confidence: 99%

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A comprehensive review on microchannel heat sinks for electronics cooling

Yu,

Li,

Cao

2024

Int. J. Extrem. Manuf.

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The heat dissipation density of electronic devices is increasing dramatically, which causes a serious heat bottleneck in electronics. Operating temperature over its rated temperature results in performance deterioration and even device damage. With the development of micro-machining technologies, microchannel heat sinks have become one of the best ways to remove the considerable amount of heat generated by the high-power electronics. It shows the advantages of large specific surface area, small size, saving coolant and high heat transfer coefficient. This paper comprehensively overviews the research progress in microchannel heat sinks and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influence factors are reviewed. Besides, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide theoretical reference and technical guidance for further research and application of microchannel heat sinks in the future.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A comprehensive review on microchannel heat sinks for electronics cooling

Yu,

Li,

Cao

2024

Int. J. Extrem. Manuf.

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“…It offers several advantages, including high heat transfer capability, long heat transport distance, flexible transport lines, antigravity heat transfer, and the absence of moving parts. These characteristics make LHPs ideal heat dissipation devices for various applications such as microelectronics, new energy vehicles, and aerospace. − In Figure a, a schematic of an LHP is depicted. When a heat load is applied to the evaporator, the liquid within the wick undergoes vaporization, resulting in the formation of evaporating menisci at the liquid–vapor interface.…”

Section: Introductionmentioning

confidence: 99%

Superior Heat and Mass Transfer Performance of Bionic Wick with Finger-like Pores Inspired by the Stomatal Array of Natural Leaf

Xu,

Long,

Chen

et al. 2024

Langmuir

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The thermal management of electronics has gained significant attention, with loop heat pipes (LHPs) emerging as an attractive solution for heat dissipation. The heat transfer performance of LHPs is influenced by the heat and mass transfer processes within the wick. However, designing the pore diameter of the wick is challenging due to the different requirements of flow resistance and capillary force. Specifically, the working fluid needs large pores to reduce resistance, while the liquid suction requires small pores to provide a large capillary force. To address this issue, we drew inspiration from the stomatal array of natural leaves used for transpiration and developed an alumina ceramic bionic wick with finger-like pores using the phase-inversion tape casting method. The finger-like pores in the wick resemble the straight hole structure of stomata, which increases the gas−liquid interface area within the wick. This design allows for timely discharge of water vapor generated by boiling, thereby reducing mass transfer resistance. Additionally, numerous micrometer-sized small pores surrounding the finger-like pores provide sufficient capillary force to replenish liquid for the gas−liquid evaporation interface. Experimental results demonstrate that the introduction of finger-like pores in the wick increases gas and water permeabilities by 2.4 and 5.2 times, respectively. Furthermore, the superior heat and mass transfer performance of the bionic wick was demonstrated with an LHP. This work effectively addresses the conflicting demands of capillary force and flow resistance, enhancing the heat transfer performance of LHPs, which holds great promise for addressing heat dissipation challenges in high power density electronic chips and has potential applications in aviation, aerospace, and microelectronics for efficient thermal management.

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“…[6][7][8] This ubiquitous boiling process has been an economical, attractive and efficient technology for energy utilization, and has found immense use in practical industrial applications, such as power plants, 9 heat exchangers, 10 nuclear reactors, 11 concentrated photovoltaics, 12 and high-power-density electronic device cooling. 13 The overall boiling process consists of the convection, nucleate boiling, transition and lm boiling, [14][15][16][17][18][19] and two key parameters including critical heat ux (CHF) and heat transfer coefficient (HTC) reect the boiling heat transfer capacity. [20][21][22][23][24][25] The CHF expresses the maximum heat ux that a boiling surface can withstand, whereas the HTC describes the capability of heat dissipation.…”

Section: Introductionmentioning

confidence: 99%

“…6–8 This ubiquitous boiling process has been an economical, attractive and efficient technology for energy utilization, and has found immense use in practical industrial applications, such as power plants, 9 heat exchangers, 10 nuclear reactors, 11 concentrated photovoltaics, 12 and high-power-density electronic device cooling. 13…”

Section: Introductionmentioning

confidence: 99%