“…[ 7 , 9 , 10 , 11 , 12 ] Moreover, some studies have reported that, once a crack is generated by stress due to the inevitable volume change of the cell during cycling, and propagated inside the SEs by the Li filament growth, a short‐circuit would occur. [ 12 , 13 , 14 , 15 , 16 ] Therefore, to circumvent this chronic issue, various approaches for introducing Li host and defect‐free densely packed SEs, and generating protective layers including artificial solid state interphase have been attempted. [ 4 , 5 , 6 , 17 , 18 ] Nevertheless, these approaches have limitations in reducing dead volume in the 3D host, forming dense SE layers without any physical defects, and making the fabrication process easier.…”