Despite the extensive
ongoing research on MoS
2
field
effect transistors (FETs), the key role of device processing conditions
in the chemistry involved at the metal-to-MoS
2
interface
and their influence on the electrical performance are often overlooked.
In addition, the majority of reports on MoS
2
contacts are
based on exfoliated MoS
2
, whereas synthetic films are even
more susceptible to the changes made in device processing conditions.
In this paper, working FETs with atomic layer deposition (ALD)-based
MoS
2
films and Ti/Au contacts are demonstrated, using current–voltage
(
I
–
V
) characterization. In
pursuit of optimizing the contacts, high-vacuum thermal annealing
as well as O
2
/Ar plasma cleaning treatments are introduced,
and their influence on the electrical performance is studied. The
electrical findings are linked to the interface chemistry through
X-ray photoelectron spectroscopy (XPS) and scanning transmission electron
microscopy (STEM) analyses. XPS evaluation reveals that the concentration
of organic residues on the MoS
2
surface, as a result of
resist usage during the device processing, is significant. Removal
of these contaminations with O
2
/Ar plasma changes the MoS
2
chemical state and enhances the MoS
2
electrical
properties. Based on the STEM analysis, the observed progress in the
device electrical characteristics could also be associated with the
formation of a continuous TiS
x
layer at
the Ti-to-MoS
2
interface. Scaling down the Ti interlayer
thickness and replacing it with Cr is found to be beneficial as well,
leading to further device performance advancements. Our findings are
of value for attaining optimal contacts to synthetic MoS
2
films.