“…Thermal expansion and the associated thermal stress are the key material properties that dictate the reliability of heterogeneous polymer device applications, such as energy conversion, − organic thin-film sensors, − and semiconductor packaging. − In polymers, a thermal expansion coefficient is intimately connected with their microstructure, including the alignment of backbones and the interactions between neighboring side chains. − When the thickness of polymers becomes comparable to their gyration length scale, their microstructure is often found to be different from that of the bulk counterpart due to the disentanglement of polymer chains. , This rearrangement of the microstructures in the thin film limit potentially gives rise to anisotropic properties of polymers, as seen in previous studies for thermal conductivity, , electrical conductivity, , and mechanical properties. , However, experimental challenges as well as the absence of the microscopic model in understanding thermal expansion coefficients of nanoscale polymer films have led to an insufficient understanding of the origin of anisotropy.…”