2011
DOI: 10.1016/j.actamat.2010.10.003
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Void growth in copper during high-temperature power-law creep

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Cited by 30 publications
(31 citation statements)
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“…For instance, copper was tested at 50% of the melting temperature indicating that growth of voids with radii of a few microns is determined by a viscous flow mechanism. 99 By following the evolution of individual voids it was concluded that void coalescence follows two stable growth regimes involving the impingement of neighbouring primary voids, followed by the coalescence of secondary voids before final rupture. 350 For AlzAl 2 O 3 particle containing composite, there is a change in the damage mechanism with matrix delamination and matrix voiding occurring at high temperature (300uC) but particle fracture contributing at 200uC.…”
Section: Void/damage Evolutionmentioning
confidence: 99%
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“…For instance, copper was tested at 50% of the melting temperature indicating that growth of voids with radii of a few microns is determined by a viscous flow mechanism. 99 By following the evolution of individual voids it was concluded that void coalescence follows two stable growth regimes involving the impingement of neighbouring primary voids, followed by the coalescence of secondary voids before final rupture. 350 For AlzAl 2 O 3 particle containing composite, there is a change in the damage mechanism with matrix delamination and matrix voiding occurring at high temperature (300uC) but particle fracture contributing at 200uC.…”
Section: Void/damage Evolutionmentioning
confidence: 99%
“…It helps quantify void nucleation and growth, 99 In the context of nanotomography the field of view is usually around 10006 the spatial resolution, which means that nanotomography is often synonymous with very small samples (see 'Local tomography and laminography' section), presenting both statistical sampling and engineering relevance issues, see 'Caveats and cautions' section.…”
Section: Very High Resolution Imagingmentioning
confidence: 99%
“…It is evident that the simulation largely underestimates the true volumetric growth, a rather surprising result since the selected cavity has an elongated shape and grows mainly along the load axis, a characteristic feature of void growth by creep flow mechanism. [9] Results of Dzieciol et al [31] indicate that the K parameter describing viscous void growth during power law creep of 99.99 pct purity copper is much higher (K % 45). In the case of copper, however, a pure proportionality between growth rate and volume was obtained, which made interpretation of void growth results rather straightforward.…”
Section: A Cavity Growth By Plastic Creep Flowmentioning
confidence: 95%
“…The existence of a void-filling mechanism in leaded brass is indirectly supported by the absence of negative growth rates in single-phase copper. [31] Since the volume fraction of lead-rich particles is small (of 2 pct), the pore filling mechanism should be marginal. This indicates, however, that the parameter K % 22 should be considered as a lower bound, because the contribution of filling mechanism to the ''positive growth rates'' is unknown.…”
Section: B Influence Of Local Cavity Surrounding On Growth Ratementioning
confidence: 99%
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