Voltammetry study of copper in chloride solution

Pardessus, L.; Crousier, J.

doi:10.1016/0013-4686(88)80192-0

Cited by 62 publications

(24 citation statements)

References 20 publications

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“…The current plateau observed for potentials more positive than the potential of the A2 peak is related to the equilibrium between the formation of CuCl film on the copper surface and the dissolution of Cu Cl -2 complex [6,10,12,15,17]. The reason for the formation of an anodic reactivation peak, Ar, observed in Figure 3 was explained previously [12].…”

Section: Cucl Adsmentioning

confidence: 72%

Electrochemical and Surface Analysis of 2-Phenylimidazole Adsorbed on Copper from Chloride Solution

Finšgar

Xhanari

2018

Coatings

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Abstract:The electroanalytical and surface characterization of copper immersed in 3 wt.% NaCl solution containing 1 mM of 2-phenylimidazole (2PhI) is presented. It was proven that 2PhI can be employed as corrosion inhibitor for copper using various electrochemical analyses, such as cyclic voltammetry, chronopotentiometry, electrochemical impedance spectroscopy, and potentiodynamic curve measurements. The adsorption of 2PhI on copper was further analyzed by 3D-profilometry, attenuated total reflectance Fourier transform infrared spectroscopy, contact angle measurements, and scanning electron microscopy equipped with an energy dispersive X-ray spectrometer. This system was therefore comprehensively described by various analytical approaches.

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Section: Cucl Adsmentioning

confidence: 72%

Electrochemical and Surface Analysis of 2-Phenylimidazole Adsorbed on Copper from Chloride Solution

Finšgar

Xhanari

2018

Coatings

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“…Considering this passive behavior occurred only in the CSC coppers and was stronger in low-purity coppers (#1 & #3) than high-purity copper (#2), the passive behavior seems to be related with the small amount of oxide at the interface of the stacked copper particles. Another passive behavior of all the copper specimens developed at around +0.25 V due to the formation of CuCl [24,25]. The degree of passivity in the commercial coppers (#4 and #5) was stronger than that of the coating coppers (#1 to #3) in this region, which means that the passive film formed on the CSC specimens is less protective than that of commercial coppers.…”

Section: Polarization Testmentioning

confidence: 94%

Application of Cold Spray Coating Technique to an Underground Disposal Copper Canister and Its Corrosion Properties

Lee¹,

Choi²,

Choi³

et al. 2011

Nuclear Engineering and Technology

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“…3) are related to the processes described in equations 2-5. These reactions were also proposed for explaining the copper/chloride interface behaviour in different chloride containing solutions with different pH values (Crousier et al, 1988;Crundwell, 1991;Deluis et al, 1993). The cyclic voltamogram obtained in the Au synthetic solution compared to the voltamogram of the blank solution is reported in figure 6.…”

Section: Cyclic Voltammetry In Single Metal Synthetic Solutionsmentioning

confidence: 95%

Gold recovery from waste electrical and electronic equipment by electrodeposition: A feasibility study

et al. 2015

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Due to rapid technological progress, the replacement of electronic equipment is very often necessary, leading to huge amounts that end up as waste. Printed circuit boards (PCBs) constitute a unique section among Waste Electrical and Electronic Equipment (WEEE), due to their content in precious and high commercial value metals. Gold, among them, is usually present in a very low quantity and its recovery requires complex chemical treatments. The aim of this work is to evaluate the feasibility of recovering Au by electrodeposition from aqueous solutions obtained after leaching of PCBs and electrical contacts prior to the recovery of any other metals. Aqua regia was used as a leachant for the powders obtained after mechanical and thermal treatment of PCBs' and contacts' parts. The leaching solutions have been analysed by ICP in order to detect the most important metals for the electrodeposition. A preliminary study using synthetic solutions of the elements which could interfere with the gold deposition was performed, followed by an electrochemical study of leach solution of PCBs and contacts. The deposition potential of gold was determined in each solution and a short potentiostatic deposition was carried out. The obtained deposits have been observed by SEM and analysed by EDXS in order to confirm the deposition and to evaluate the purity of the obtained deposits. Aqua regia was proved to be an efficient leachant for the dissolution of all metals from powders obtained after thermal treatment of PCBs and contacts. Among the metals present in the leach solution only copper can interfere with the deposition of gold as the reduction peaks of the auric chloride complex and the Cu2+ ions are very close. However, the deposition of Au was possible, even with low efficiency. The deposition rate increases by increasing the temperature at 40 degrees C and the stirring of the electrolyte. A compact nanocrystalline deposit of high purity gold has been obtained by electrodeposition at 0.55 V vs. Ag/AgCl/KCl3M from the contacts' leach solution. Therefore, this study demonstrates the feasibility of gold recovery from PCBs' and contacts' leach solutions by electrodeposition, without any further chemical treatmen

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Voltammetry study of copper in chloride solution

Cited by 62 publications

References 20 publications

Electrochemical and Surface Analysis of 2-Phenylimidazole Adsorbed on Copper from Chloride Solution

Electrochemical and Surface Analysis of 2-Phenylimidazole Adsorbed on Copper from Chloride Solution

Application of Cold Spray Coating Technique to an Underground Disposal Copper Canister and Its Corrosion Properties

Gold recovery from waste electrical and electronic equipment by electrodeposition: A feasibility study

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