VPS solution for lead-free soldering in EMS industries

Plotog, Ioan; Varzaru, Gaudentiu; Turcu, Cristina Elena; Cucu, Traian; Svasta, Paul; Codreanu, Norocel

doi:10.1109/estc.2008.4684336

Cited by 15 publications

(4 citation statements)

References 1 publication

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“…Then the assembly is immersed into the vapour; the vapour condensates onto the surface of the assembly, and the released latent heat provides the energy to melt the solder alloy [16,17]. The advantage of this soldering method is that the heat transport stops automatically when the temperature of the assembly reaches the temperature of the saturated vapour, thus providing uniform temperature distribution along the surface of the assembly [18,19].…”

Section: Methodsmentioning

confidence: 99%

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Krammer

Garami

Horváth

et al. 2015

Journal of Alloys and Compounds

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Section: Methodsmentioning

confidence: 99%

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Krammer

Garami

Horváth

et al. 2015

Journal of Alloys and Compounds

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“…The resistors were planted in the same position on each of PCBs. The PCBs having all five finishes, was soldered with P2 thermal profiles defined for experiments in the same time [6,7].…”

Section: A Experiments Descriptionmentioning

confidence: 99%

“…Due to the vapors atmosphere the soldering is achieved in oxygen free environment that making the use of nitrogen unnecessary [3,4]. Considering the reliability of electronic modules as expression of solder joints functionality, could be emphasized the connection with their microstructure [5,6]. From this point of view, the intermetallic compounds formation as result of solder material phase changes phenomena occurring in the soldering process is more important being determined by the specific thermal profile according with soldering technology used [5,7].…”

Section: Introductionmentioning

confidence: 99%

Multicriterial approach correlation of the solder joints functional tests results

Plotog

Cucu

Mihailescu

et al. 2010

2010 9th International Symposium on Electronics and Telecommunications

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The assembling of the electronic components on PCBs becomes a key issue in electronic packaging reliability. The solder joints resulting from the soldering process represent an important outcome for the PCB assembling. Moreover, the Lead Free soldering requests, imposed by the RoHS Directive, can cause difficulties in obtaining a high quality/reliable soldering process. Considering the reliability of electronic modules as expression of solder joints functionality, could be emphasized the lack of tests over solder joints functionality on assembling line.Usually are realized optical inspections and, in precise situation, X-Ray analysis are done over assembled PCBs being followed by "in circuit" electrical functional tests. The defects type "hide" or "cold/dry joints" could be not found. In the paper are presented the results of the functional tests of solder joints realized in two soldering technology, infrared-convection and vapor phase.Regarding to thermal functionality, infrared analysis of temperature distribution on the surface of a populated PCBs using thermovision were done.A correlation among functionality, reliability and thermovision functional analysis will be realized based on the experiments results. In consequence, the authors emphasize thermovision as available in circuit indirect test method for "hide" defects of solder joints.

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“…Vapour Phase Soldering (VPS) is an emerging reflow soldering method (Leicht and Thumm, 2008) in Surface Mount Technology. It has gained more attention from the electronics industry (Plotog et al, 2008) since the introduction of Galden type heat transfer fluids and the implementation of the ROHS directive (Thumm, 2010). Its exceptional approach to heat transfer eliminates problems of conventional ovens, but also requires new considerations for proper temperature and heat transfer control.…”

Section: Introductionmentioning

confidence: 99%

Comparative study on proper thermocouple attachment for vapour phase soldering profiling

Géczy

Kvanduk

Illés

et al. 2016

Soldering &Amp; Surface Mount Technology

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Purpose – The paper aims to present a comparative study of various thermocouple (TC) attaching methods for the proper measurement of soldering temperature profiling during vapour phase soldering (VPS). The heat transfer process during VPS is different from common methods, while the required heat for reflow is provided by the condensation. The condensate is a flowing layer on the board, where the dynamic behaviour also affects the local conditions on the surfaces. Temperature measurements based on TCs are also affected this way; it is important to investigate the process for deeper understanding. Design/methodology/approach – Bare printed circuit boards (PCBs) were prepared for standard K-Type TCs attachment with industry standard materials: kapton polyimide tape, aluminium tape, SMD adhesive and high-temperature solder (HTS). Heating experiments were performed in a batch-type VPS oven with Galden LS240 fluid and fixed oven parameters. Findings – According to the specific attachment requirements, HTS and Alu-tape are the suggested methods for better profiling reliability and repeatability. Alu-tape is the preferred all-around method, for fast, exchangeable, cheap, reliable and repeatable profiling in a VPS oven. It was presented that the heating factor (Q?) gives more reliable comparison overview; the time period-based comparisons may be affected by the thermal inertia, while heating factor also includes temperature conditions at the given time points. Originality/value – The paper presents the reliability of the presented methods for VPS and present suggestions for the use of different TC ends and attaching materials during condensation heating of the PCBs. Also a new approach on profiling data evaluation based on the heating factor is presented and suggested for wider use.

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VPS solution for lead-free soldering in EMS industries

Cited by 15 publications

References 1 publication

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

Multicriterial approach correlation of the solder joints functional tests results

Comparative study on proper thermocouple attachment for vapour phase soldering profiling

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