The Relationship Between Vacuum Maintaining Time andMany MEMS devices such as accelerators, gyroscopes, Leak Rate un-cooled infrared sensors, etc. require vacuum packaging.The devices which need to work in vacuum environment The vacuum maintaining lifetime directly determines the not only require a specific vacuum level, but also the vacuum vacuum packaging reliability. This research presented a level should be maintained for enough time to ensure its quantitatively analysis of the relationship between the leak working lifetime. Generally changes in the vacuum pressure rate and the vacuum maintaining lifetime, and demonstrated come from three factors. One is that the gases absorbed on the the leak rate measurement plays great importance. This paper surface and dissolved in the package materials are released also explored the application limitations in vacuum packaging into package cavity. The second is that the gases outside the using helium spectrometer leak tester to measure the leak rate package permeate into package cavity. And the third is the because the measured leak rate was nonlinear with respect to dominant one that gases will leak into cavity through the the actual leak size. According to the fact that the damping welding seam. Assuming the package cavity vacuum level is coefficient changes with the pressure, a tuning fork crystal about 0. IPa, and the changes in the vacuum pressure comes chip as a pressure sensor was used to monitor the pressure mainly from leaks, leak rate ( Pa.m3 I S ) or leak changes in the package cavity. The leak conductance was also 3 calculated from the pressure tracking data to analyze the leak conductance (in3I s) are usually used to describe welding modes, the molecular flow model and gas desorption model seam leak quantitatively. Obviously, the following equation were found to fit the measurement results of leak conductance. (1.1) can be used to formulate the changes of the vacuum