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J of Applied Polymer Sci

2012

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We studied the gas permeation properties of poly(ether ether ketone) (PEEK) and compared it with two other polymers commonly used in the construction of semiconductor microenvironments, polycarbonate (PC), and poly(ether imide) (PEI). The PEEK specimens consisted of extruded films as well as compression-and injection-molded specimens. The compression-molded specimens were prepared to achieve the highest crystallinity. Injection-molded disks, representing products, were milled to a prescribed thickness. Permeation, diffusion, and solubility coefficients were measured on these various PEEK specimens for hydrogen, nitrogen, and oxygen gases. It was found that PEEK generally has better permeation resistance than PC or PEI; showing up to five times lower permeation rates than PC or PEI, depending on grade, crystallinity, and gas. The superior permeation resistance of injection-molded or extruded PEEK, when compared with similarly processed PC or PEI, comes from its crystallinity.

Section: Introductionmentioning

confidence: 99%

Permeation resistance of poly(ether ether ketone) to hydrogen, nitrogen, and oxygen gases

Monson

Moon

J of Applied Polymer Sci

2012

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Insert‐molded poly(ether imide)/carbon fiber poly(ether ether ketone) bimaterial composites: Fracture and interfacial analysis

Moon

Monson

J of Applied Polymer Sci

2006

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Bimaterial composites were constructed by injecting carbon-fiber-filled poly(etheretherketone) (CF PEEK) into a mold containing one-half of a poly(etherimide) (PEI) tensile specimen. Specimens were notched at the interface and tested in tension. Using fracture mechanics, the adhesion strength of the interface (a fracture energy with units of energy per area) was calculated from notch size and stressstrain behavior of the notched specimens. Fracture energies (with units of energy per area) of the PEI/CF PEEK bimaterial composites were slightly less than those measured from the monolithic materials of construction. Variations in test speed (below the glass transition temperature of the two components) had little effect on stiffness or fracture energy. However, fracture energies decreased slightly as temperature increased. Composites fractured through the CF PEEK near the PEI/CF PEEK interface. Consequently, the fracture surface of the PEI portion had a thin layer of CF PEEK (a qualitative indicator of good adhesion). Microscopy and X-ray photoelectron spectroscopy confirmed the presence of a thin layer of CF PEEK on the PEI. It appears that the miscibility of PEI and PEEK contributed to the strength of the PEI/CF PEEK thermophysical bond. The strength of the thermophysical bond of the PEI/CF PEEK bimaterial composites was greater than the cohesive strength of amorphous commodity polymers such as polystyrene and should be more than adequate for most microelectronics device handling applications.

The mechanical properties of insert‐molded bimaterial composites

Polymer Engineering & Sci

Bhatt

2001

Bimaterial composite samples were constructed by injecting various polymers into a mold containing a fraction of a pre‐molded specimen. The resulting series composites were tested in tension. Breaking stresses were independent of fractional length. Conversely, both elongation to break and apparent stiffness varied with Although samples broke at or near the interface, adhesion was reasonably good, as indicated by transfer of material across interfaces.