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Boinard, E.; Pethrick, Richard A.; Dalzel-Job, J.; MacFarlane, C.J.

doi:10.1023/a:1004766418966

Cited by 51 publications

(20 citation statements)

References 9 publications

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“…Subsequent to this, lower molecular weight species can also be leached out resulting in an increase in the glass transition temperature and a change in the loss tangent peak profile [14,17]. This phenomenon is often termed the anti-plasticization effect.…”

Section: Resultsmentioning

confidence: 99%

Multi-frequency dynamic mechanical thermal analysis of moisture uptake in E-glass/vinylester composites

Karbhari

Wang

2004

Composites Part B: Engineering

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Section: Resultsmentioning

confidence: 99%

Multi-frequency dynamic mechanical thermal analysis of moisture uptake in E-glass/vinylester composites

Karbhari

Wang

2004

Composites Part B: Engineering

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“…[40][41][42] The moisture absorption measurement is shown in Table IV. It showed that all cured aromatic bridging group containing epoxy resins (II b and II c ) had better moisture resistance than that of aliphatic bridging group containing epoxy resin (II a ).…”

Section: Effect Of the Structure Of Epoxy Resins On The Moisture Absomentioning

confidence: 99%

Effect of Structure of Bridging Group on Curing and Properties of Bisphenol-A Based Novolac Epoxy Resins

Pan

Zhang

et al. 2007

Polym J

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ABSTRACT:Three bisphenol-A based novolac epoxy resins with different bridging groups: methylene, methinephenyl and methine-naphthyl, respectively, between bisphenol-A phenyl rings were prepared to study the effect of structure of bridging group on curing and properties of the epoxy resins. The structures of the obtained epoxy resins were characterized using FT-IR and 1 H NMR spectra, the molecular weight and polydispersity index were determined using GPC. The effect of bridging groups on the curing kinetics, thermal mechanical properties, thermal stability, and moisture resistance of the synthesized epoxy resins cured with 4,4 0 -diaminodiphenyl sulphone (DDS) were investigated by dynamic differential scanning calorimetry, dynamic mechanical analysis, thermogravimetric analysis, X-ray diffraction and moisture absorption measurement. It was concluded that the methylene-bridged epoxy resin possessed the highest curing reaction reactivity toward DDS and the methine-naphthyl-bridged epoxy network possessed the highest storage modulus, glass transition temperatures, thermal stability, and moisture resistance. Epoxy resin has been utilized in many applications such as surface coatings, structural adhesives, printed circuit board, insulation materials for electronic devices, and advanced composites matrices due to its good thermal and dimensional stability, excellent chemical and corrosion resistance, and superior mechanical and electrical properties, in addition to ease of handling and processabilities. However, in hightech applications lower thermal expansion, higher toughness, better heat and moisture resistance were required.1 For this reason, much work has been continuously directed toward improving their thermal and physical properties by modifications of epoxy resins, in both backbone and pendant groups. 2-5Several approaches were adopted to enhance the heat resistance of epoxy resins with increasing crosslink density or introducing bulky structures such as biphenyl or naphthalene.6-8 The introduction of naphthalene moiety is expected to greatly improve the thermal property and moisture resistance owing to its excellent rigidity, facile packing of molecules and significant degree of hydrophobicity.9-14 Many studies reported that epoxy resin showed remarkably higher glass transition temperature (T g ), higher thermal stability, higher flexural modulus, better moisture resistance, lower coefficient of thermal expansion when stiff naphthalene was inserted or appended by chemical modification. [15][16][17][18] In order to design and develop more novel epoxy resins with higher thermal and mechanical properties to meet the application need, the deeply understanding the effect of the molecular structure of materials on curing behavior, chemical and physical properties of epoxy resin was increasingly more important, because it can predict the end product properties of the new materials and provide a guide for the development process and speed up the development cycle. Varley et al. utilized the relationship between the ...

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“…By monitoring the curvature distribution profile the internal stress can be monitored. 436 The results show that the rate of moisture absorption is important for the retention of properties because laminate reaches an earlier moisture equilibrium when the rate of water absorption is higher. 433 Hygrothermal cycling (water absorption and desorption) damages the laminate.…”

Section: Laminatesmentioning

confidence: 92%

“…As with composites (see Section 16.9) water diffusion, and especially water in the laminate [433][434][435][436][437][438][439][440][441][442][443] at elevated temperature is the most damaging environmental interference. 433 Absorption of water increases as the temperature increases (Figure 16.67).…”

Section: Laminatesmentioning

confidence: 99%