2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 2014
DOI: 10.1109/ectc.2014.6897461
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Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility

Abstract: In this paper, we will describe a new low cost solder bumping technology for use on wafers. The wafer IMS (injection molded solder) process can form fine pitch solder bumps on wafers, while offering greater solder alloy flexibility. This method is also applicable to form uniform solder bump heights when a wafer has different size and shape of I/O pads. The wafer IMS bumping process uses a solder injection head that melts the desired bulk solder alloy composition and then dispenses the molten solder into resist… Show more

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Cited by 24 publications
(6 citation statements)
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“…In this process, molten solder metal is squeezed out from the nozzle tip on the Cupillar. [92,93]. This IMS process consists of the following steps: 1. seed layer preparation and photoresist patterning on a Si wafer, 2.…”
Section: Solder Injection On Cu-pillarmentioning
confidence: 99%
See 1 more Smart Citation
“…In this process, molten solder metal is squeezed out from the nozzle tip on the Cupillar. [92,93]. This IMS process consists of the following steps: 1. seed layer preparation and photoresist patterning on a Si wafer, 2.…”
Section: Solder Injection On Cu-pillarmentioning
confidence: 99%
“…This IMS process consists of the following steps: 1. seed layer preparation and photoresist patterning on a Si wafer, 2. Cu pillar (post) plating, 3. solder bumping by IMS, 4. photoresist & seed layer stripping [92]. The schematic illustration is shown in Figure 21.…”
Section: Solder Injection On Cu-pillarmentioning
confidence: 99%
“…However, novel bumping processes are required to satisfy the variety of recent requirements for high I/O density, fine bump pitch, novel solder bump composition, and further process cost reductions. Recently, a promising bumping process called "Injection Molded Solder (IMS)" was proposed [6][7][8][9][10][11] . In this process, molten solder is directly injected into holes patterned in photoresist mask films, instead of carrying out conventional electroplating.…”
Section: Introductionmentioning
confidence: 99%
“…IMS (Injection Molded Solder) is an advanced solder bumping technology on wafer and laminate [1][2][3][4][5]. IMS is a very simple technology, and solder bumps can be formed by the injection of molten solder into openings of a resist mask in a nitrogen environment without any flux application.…”
Section: Introductionmentioning
confidence: 99%