Wafer level analysis and simulation of back end of line chemical mechanical polishing processes

Katakamsetty, Ushasree; Voykov, Stefan; Bott, Sascha; Nakagawa, Sam; Gbondo-Tugbawa, Tamba; Gower-Hall, Aaron; Lee, Brian; Chee, Jansen; Geng, Henry; Zhu, Weiyang; Li, Bifeng; Ichikawa, Kimiko

doi:10.1117/12.2616078

DTCO and Computational Patterning 2022

DOI: 10.1117/12.2616078

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Wafer level analysis and simulation of back end of line chemical mechanical polishing processes

Ushasree Katakamsetty

Stefan Voykov²,

Sascha Bott

et al.

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Wafer level analysis and simulation of back end of line chemical mechanical polishing processes

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