Abstract:Fabrication of sub-100-nm metal-oxide-semiconductor field-effect transistors with asymmetrical source/drain using I-line double patterning techniqueOptimization of critical dimension (CD) uniformity during a spacer-defined double patterning process was explored. Image log-slope (ILS) was used as a major metric in optimizing the CD uniformity as well as the vertical sidewall of the developed resist pattern, which was used as a core-mandrel. In aerial image optimization, mask CD, mask pitch, target CD, defocus, … Show more
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