Wafer-level integration technology of surface mount devices using automatic parts alignment technology with vibration

Kizuna

2007 Fourth International Conference on Networked Sensing Systems

et al. 2007

In this paper, the concept and experimental results of Microwave-powered silicon microsensors for distributed and embedded sensing applications are presented. This is the first report of a microsensor device integrated with RF-DC power converter on the same chip. The integrated sensors are fabricated by silicon-MEMS (Micro Electromechanical Systems) technology. This time, 'fuse-type strain detector', and 'water-leakage sensing switch' are fabricated by silicon micromachining. Driving power of the integrated microsensors is provided as a remote RF-electromagnetic wave at 1.29GHz/1.45GHz, and received at the rectenna circuit on the microsensor. In the fabrication experiments, high-performance Surface Mount Devices (SMD) are integrated on the silicon microchip to realize the highest power efficiency. Mount holes of SMDs were formed by Deep-RIE of silicon with MEMS sensor structures without any additional process steps. Fabricated rectenna and sensors are successfully evaluated with LED mounted for signal output. The battery-less microsensor chip was successfully driven by a 10W/1.29GHz microwave power. Using a directional antenna as the power emission source, spread of microwave power is limited, and a longer distance of microwave power transmission is obtainable. The RF-powered microsensor node is very promising for various applications, and its conceptual prototype has been successfully fabricated.

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Section: Rf (Microwave) -Powermentioning

confidence: 99%

Section: Integrated Rectenna Circuitmentioning

confidence: 99%

RF-Powered Silicon-MEMS Microsensors for Distributed and Embedded Sensing Applications

Kizuna

2007 Fourth International Conference on Networked Sensing Systems

et al. 2007

show abstract

“…Fig. 1 shows a conceptual diagram of the Silicon one-chip wireless power supply system using our SMD integration technology [12]. Except for the power receiving antenna, all the components are integrated on a chip.…”

Section: Introductionmentioning

confidence: 99%

A novel RF induced power supply system for monolithically integrated ubiquitous micro sensor nodes

Sudou

Sensors and Actuators A: Physical

et al. 2008

“…The power source has serious problems, such as size, weight, and maintenance. An RF-induced power supply system (RF-IPSS) has been developed to solve such problems [6]- [9]. The RF-IPSS was possible to supply dc power of 4V/1 mA to the load during 10 ms periodically in our previous work [9].…”

mentioning

confidence: 99%

CMOS RF Transmitter Using Pulsewidth Modulation for Wireless Smart Sensors

Lee

IEEE Trans. Compon., Packag. Manufact. Technol.

et al. 2012