Wafer Manufacturing and Slicing Using Wiresaw

Kao, Imin; Chung, Chunhui; Rodriguez, Roosevelt Moreno

doi:10.1007/978-3-540-74761-1_52

Cited by 2 publications

(1 citation statement)

References 40 publications

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“…These wafers typically have thicknesses ranging from 100 to 300 micrometers and diameters of 125 to 200 millimeters [28]. Diamond wire sawing has become the preferred method for wafering due to its higher throughput, lower kerf loss, and reduced consumable costs compared to traditional slurry-based sawing techniques [29].…”

Section: Waferingmentioning

confidence: 99%

Advancements in Solar Cell Fabrication Techniques: A Comprehensive Review

yadav,

Kumari,

Gupta

et al. 2024

Preprint

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Solar energy has emerged as a promising alternative to traditional fossil fuels due to its abundant availability and sustainability. Solar cells, the fundamental units of solar energy conversion, have undergone significant advancements in fabrication techniques to enhance their efficiency, durability, and cost-effectiveness. This review aims to provide a comprehensive overview of various methods employed in the preparation of solar cells, including thin-film, crystalline silicon, organic, and perovskite-based technologies. By analyzing recent research developments, challenges, and future prospects, this article sheds light on the evolving landscape of solar cell fabrication, contributing to the ongoing efforts in achieving widespread adoption of solar energy.

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Section: Waferingmentioning

confidence: 99%

Advancements in Solar Cell Fabrication Techniques: A Comprehensive Review

yadav,

Kumari,

Gupta

et al. 2024

Preprint

View full text Add to dashboard Cite

show abstract

Study on the performance of nanocomposite wire guides in wire sawing process

Chung

Lin

2018

Int. J. Mod. Phys. B

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In semiconductor wafer manufacturing, wire sawing is the first machining process to slice an ingot into hundreds of wafers. The cutting tool is a tiny wire which is wound on the wire guides. The material of the wire guides is essential to stabilize the process and to control the wafer thickness. However, there are few studies on the materials and the properties of the wire guides. In order to enhance the performance of wire sawing, this study investigated wire sawing process with the guides made of polyurethane reinforced by nanoTiO2 (PU/TiO2) and nanographite (PU/graphite). The results show the PU reinforced by nanoTiO2 was outperformed in wear resistance, although the surface roughness was slightly worse than the PU reinforced by nanographite.

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Wafer Manufacturing and Slicing Using Wiresaw

Cited by 2 publications

References 40 publications

Advancements in Solar Cell Fabrication Techniques: A Comprehensive Review

Advancements in Solar Cell Fabrication Techniques: A Comprehensive Review

Study on the performance of nanocomposite wire guides in wire sawing process

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