Wafer Processing

Möller, Hans Joachim

doi:10.1007/978-3-662-52735-1_16-1

Cited by 1 publication

(1 citation statement)

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“…The surface roughness of mirrors in deep ultraviolet (DUV) lasers and ultrahigh power laser systems is required to reach an Ra<0.2 nm and a flatness of N<60 nm [1,2]. In order to realize extreme ultraviolet (EUV) exposure, the total thickness variation of a 12 inch bare silicon (Si) wafer is required to be less than 200 nm; and the middle spatial frequency roughness is required to be less than 0.1 nm [3]. In addition, inertial confinement fusion (ICF) is a fusion energy research project that attempts to initiate nuclear fusion reactions by heating and compressing a fuel target, typically in the form of a pellet that contains a mixture of deuterium and tritium.…”

Section: Introductionmentioning

confidence: 99%

Manufacturing technologies toward extreme precision

Zhang

Yan

Kuriyagawa

2019

Int. J. Extrem. Manuf.

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Precision is one of the most important aspects of manufacturing. High precision creates high quality, high performance, exchangeability, reliability, and added value for industrial products. Over the past decades, remarkable advances have been achieved in the area of high-precision manufacturing technologies, where the form accuracy approaches the nanometer level and surface roughness the atomic level. These extremely high precision manufacturing technologies enable the development of high-performance optical elements, semiconductor substrates, biomedical parts, and so on, thereby enhancing the ability of human beings to explore the macro- and microscopic mysteries and potentialities of the natural world. In this paper, state-of-the-art high-precision material removal manufacturing technologies, especially ultraprecision cutting, grinding, deterministic form correction polishing, and supersmooth polishing, are reviewed and compared with insights into their principles, methodologies, and applications. The key issues in extreme precision manufacturing that should be considered for future R&D are discussed.

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Section: Introductionmentioning

confidence: 99%