Wafer scale patterning by soft UV-Nanoimprint Lithography

Plachetka, Ulrich; Bender, Markus; Fuchs, Andreas; Vratzov, B.; Glinsner, T.; Lindner, Florian; Kurz, H.

doi:10.1016/j.mee.2004.02.035

Cited by 29 publications

(29 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This can be achieved using nanoimprint lithography (NIL) with interference lithography as the mastering technology [6][7][8]. NIL has been used to texture c-Si wafers with linear and crossed micron-scale gratings in this work.…”

Section: Introductionmentioning

confidence: 99%

Nanoimprinted diffraction gratings for crystalline silicon solar cells: implementation, characterization and simulation

Mellor¹,

Hauser²,

Wellens³

et al. 2013

Opt. Express

View full text Add to dashboard Cite

Light trapping is becoming of increasing importance in crystalline silicon solar cells as thinner wafers are used to reduce costs. In this work, we report on light trapping by rear-side diffraction gratings produced by nano-imprint lithography using interference lithography as the mastering technology. Gratings fabricated on crystalline silicon wafers are shown to provide significant absorption enhancements. Through a combination of optical measurement and simulation, it is shown that the crossed grating provides better absorption enhancement than the linear grating, and that the parasitic reflector absorption is reduced by planarizing the rear reflector, leading to an increase in the useful absorption in the silicon. Finally, electrooptical simulations are performed of solar cells employing the fabricated grating structures to estimate efficiency enhancement potential.

show abstract

Section: Introductionmentioning

confidence: 99%

Nanoimprinted diffraction gratings for crystalline silicon solar cells: implementation, characterization and simulation

Mellor¹,

Hauser²,

Wellens³

et al. 2013

Opt. Express

View full text Add to dashboard Cite

show abstract

“…12,13 PDMS materials are applied using cast moulding or spin coating on the patterned master and are thermally cured afterward. A primer is used to bond the stamp onto a carrier substrate during the curing process.…”

Section: Master Origination and Stamp Replicationmentioning

confidence: 99%

Development of nanoimprint processes for photovoltaic applications

Hauser

Tucher

Tokai

et al. 2015

J. Micro/Nanolith. MEMS MOEMS

View full text Add to dashboard Cite

Abstract. Due to its high resolution and applicability for large area patterning, nanoimprint lithography (NIL) is a promising technology for photovoltaic (PV) applications. However, a successful industrial application of NIL processes is only possible if large-area processing on thin, brittle, and potentially rough substrates can be achieved in a high-throughput process. The development of NIL processes using the SmartNIL technology from EV Group with a focus on PV applications is described. The authors applied this tooling to realize a honeycomb texture (8 μm period) on the front side of multicrystalline silicon solar cells, leading to an improvement in optical efficiency of 7% relative and a total efficiency gain of 0.5% absolute compared to the industrial standard texture (isotexture). On the rear side of monocrystalline silicon solar cells, the authors realized diffraction gratings to make use of light trapping effects. An absorption enhancement of up to 35% absolute at a wavelength of 1100 nm is demonstrated. Furthermore, photolithography was combined with NIL processes to introduce features for metal contacts into honeycomb master structures, which were initially realized using interference lithography. As a final application, the authors investigated the realization of very fine contact fingers with prismatic shape in order to minimize reflection losses.

show abstract

“…Then, the hard-PDMS is spin coated on the silicon master mold and the used thickness is mainly 5-8 µm and supported by a standard PDMS layer (∼1.5 mm) (see figure 3). The standard PDMS layer keeps a good flexibility and adaptation on the spin coated wafer during imprint transfer [31]. Then, the bilayer stamp is placed on a glass carrier.…”

Section: Bilayer Hard-pdms/pdms Stamp Fabrication Processmentioning

confidence: 99%

Sub-30 nm Plasmonic Nanostructures by Soft UV Nanoimprint Lithography

Barbillon¹

2013

Updates in Advanced Lithography

View full text Add to dashboard Cite

Wafer scale patterning by soft UV-Nanoimprint Lithography

Cited by 29 publications

References 3 publications

Nanoimprinted diffraction gratings for crystalline silicon solar cells: implementation, characterization and simulation

Nanoimprinted diffraction gratings for crystalline silicon solar cells: implementation, characterization and simulation

Development of nanoimprint processes for photovoltaic applications

Sub-30 nm Plasmonic Nanostructures by Soft UV Nanoimprint Lithography

Contact Info

Product

Resources

About