2020
DOI: 10.1038/s41928-020-0396-x
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Wafer-scale production of patterned transition metal ditelluride layers for two-dimensional metal–semiconductor contacts at the Schottky–Mott limit

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Cited by 122 publications
(81 citation statements)
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References 56 publications
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“…This is likely due to the growth occurring at a solid-liquid interface, rather than the typical solid-vapour one. Having the liquid Te in direct contact with the W layer counteracts the low activity of Te and facilitates the synthesis of WTe 2 at the comparatively low synthesis temperature and short time, which is similar to other works using Ni x Te y alloys [45]. Furthermore, H 2 is not required, unlike previously reported methods [46].…”
Section: Synthesis Of Wte 2 Filmssupporting
confidence: 62%
“…This is likely due to the growth occurring at a solid-liquid interface, rather than the typical solid-vapour one. Having the liquid Te in direct contact with the W layer counteracts the low activity of Te and facilitates the synthesis of WTe 2 at the comparatively low synthesis temperature and short time, which is similar to other works using Ni x Te y alloys [45]. Furthermore, H 2 is not required, unlike previously reported methods [46].…”
Section: Synthesis Of Wte 2 Filmssupporting
confidence: 62%
“…The fundamental reason for causing the opposite result is that unlike 3D metal Pd, the 2D metal 1T′-MoTe 2 can suppress the strong Fermi pinning effect at the metal-semiconductor interface. In reality, the Schottky barrier heights between most 3D metals and monolayer MoS 2 had seriously deviated from the Schottky-Mott rule 22,24 , resulting in the significantly lower Schottky barrier of 0-0.3 eV than the theoretical values in Fig. 2e.…”
Section: Resultsmentioning
confidence: 82%
“…Both achieving the designed Schottky barrier height and precisely controlling the barrier width are crucial for realizing the full potential of Schottky diodes. For Schottky barrier height, transferring metals or employing 2D metals can build weak Fermi pinned Schottky junctions to roughly satisfy the personalized barrier height 2,[21][22][23] . The 2D metals (e.g., 1T′-MoTe 2 , 1T′-WTe 2 , 1T′-PtSe 2 , and 2H-NbSe 2 ), by contrast, have more potential in creating high-grade Schottky junctions because their Schottky barrier heights strictly follow the trend of the Schottky-Mott model.…”
mentioning
confidence: 99%
“…Secondly, in the aspect of practical applications in (opto)electronics, the contact effect between metal and semiconductor is an undeniable problem, which plays a deterministic role in devices based on wafer-scale vdWHs. 186,187 Despite the enhanced carriers transport in vdWHs channels, 148,188 many (opto)electronic devices still show low mobility due to the high contact resistance and Schottky barrier height (SBH). 189,190 The poor contact between vdWHs and metal electrodes is the result of profound Fermi pining effect and uneven contact interface in a large area.…”
Section: Discussionmentioning
confidence: 99%
“…191,192 Hence, modifying the metalsemiconductor contact interface is an effective strategy to improve device performance. Specifically, using metallic 2D materials (graphene, 193 some 1 T phase TMDs 47,187,[194][195][196][197] ) as electrodes for (opto)electronics through epitaxy growth 35 or phase transition 198,199 will alleviate the pining effect. In addition, transferring the prefabricated metal electrodes can also avoid creating defects and strains, resulting in an atomically sharp and near perfect metal/2D semiconductor interface.…”
Section: Discussionmentioning
confidence: 99%