2020 5th International Conference on Mechanical, Control and Computer Engineering (ICMCCE) 2020
DOI: 10.1109/icmcce51767.2020.00323
|View full text |Cite
|
Sign up to set email alerts
|

Wafer Surface Defect Detection Based On Improved YOLOv3 Network

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
3
2
1

Relationship

0
6

Authors

Journals

citations
Cited by 6 publications
(2 citation statements)
references
References 0 publications
0
2
0
Order By: Relevance
“…Kawakami et al used YOLOv2 to detect medical images, verifying the practicability of the method in terms of precision and speed [27]. Cao et al introduced the SPP module into the backbone network of YOLOv3 and the feature fusion network of YOLOv3, and used the Mish activation function to improve the problem of poor detection performance of small objects, which was caused by the lack of local information [28]. Xie et al introduced the multistage residual hybrid attention module (MRHAM) into the YOLOv4 network structure and clustered prior frames using the K-means++ clustering algorithm.…”
Section: Related Work 21 Application Of Yolo In Mask-wearing Detectionmentioning
confidence: 99%
“…Kawakami et al used YOLOv2 to detect medical images, verifying the practicability of the method in terms of precision and speed [27]. Cao et al introduced the SPP module into the backbone network of YOLOv3 and the feature fusion network of YOLOv3, and used the Mish activation function to improve the problem of poor detection performance of small objects, which was caused by the lack of local information [28]. Xie et al introduced the multistage residual hybrid attention module (MRHAM) into the YOLOv4 network structure and clustered prior frames using the K-means++ clustering algorithm.…”
Section: Related Work 21 Application Of Yolo In Mask-wearing Detectionmentioning
confidence: 99%
“…These iterations have seen a steady improvement in detection performance, garnering extensive attention and becoming a focal point of research within the industry [15,16]. Cao et al improved the YOLOv3 network model to solve the problem of difficult detection of acceptable defects on the wafer surface, and mAP increased by 13 percentage points and improved the detection speed [17]. Lan et al utilized YOLOv3 as a foundational model and introduced the integration of the batch normalization (BN) layer with the convolutional layer.…”
Section: Related Workmentioning
confidence: 99%