Wafer to wafer bonding to increase memory density

Yolanda, Dube Belinda Langelihle

doi:10.1109/cstic55103.2022.9856846

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Wafer to wafer bonding to increase memory density

Cited by 2 publications

References 6 publications

Optimal Machine Learning Model for the Relationship Between Grain Size, Channel Thickness, and Grain Boundary Trap Density in 3D NAND Strings

Optimal Machine Learning Model for the Relationship Between Grain Size, Channel Thickness, and Grain Boundary Trap Density in 3D NAND Strings

High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions

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