Warpage Analysis of Fan-Out Panel-Level Packaging Using Equivalent CTE

Tsai, Chun-Horng; Liu, S. W.; Chiang, Kuo‐Ning

doi:10.1109/tdmr.2019.2956049

Cited by 23 publications

(2 citation statements)

References 14 publications

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“…In addition, the thickness of a glass substrate can be modified without additional thinning and polishing processes, and through glass via (TGV) technology does not require an additional barrier layer, greatly reducing the production cost. Moreover, the coefficient of thermal expansion (CTE) of glass can be optimized to reduce warpage [ 4 , 5 ] and improve the reliability life of stacked fan-out wafer-level packaging (FO-WLP). Hence, a fan-out structure with a glass substrate is favorable for high-frequency applications [ 4 , 6 ].…”

Section: Introductionmentioning

confidence: 99%

“…Moreover, the coefficient of thermal expansion (CTE) of glass can be optimized to reduce warpage [ 4 , 5 ] and improve the reliability life of stacked fan-out wafer-level packaging (FO-WLP). Hence, a fan-out structure with a glass substrate is favorable for high-frequency applications [ 4 , 6 ]. However, before mass production, packaging must pass reliability life testing under thermal cycling loading; in the JEDEC(Joint Electron Device Engineering Council) standard (JESD22-A104D), the thermal range is −40 to 125 °C.…”

Section: Introductionmentioning

confidence: 99%

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Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

2021

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The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.

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