Warpage deformation analysis of AMB ceramic substrates in power modules

Hu, Dong; Wang, Chieh; Li, Zichuan; Gupta, Nikhil; Poelma, René H.; Shi, Ziliang; Fan, Jiajie; Zhang, Guoqi

doi:10.1109/eurosime60745.2024.10491425

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2024

DOI: 10.1109/eurosime60745.2024.10491425

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Warpage deformation analysis of AMB ceramic substrates in power modules

Dong Hu,

Chieh Wang,

Zichuan Li

et al.

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Warpage deformation analysis of AMB ceramic substrates in power modules

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References 16 publications

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