2019
DOI: 10.1007/s12540-019-00492-z
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Warpage of Powder Injection Molded Copper Structure

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Cited by 6 publications
(1 citation statement)
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“…If the injection variables are not selected correctly, it will be caused various defects such as separation and void in the sintered parts [19,20]. Also, an increase in injection temperature will cause binder components decomposition during the injection [21,22]. However, if the particle growth is prevented somehow during the sintering process, it is best to simultaneously increase the strength and decrease the particle size distributions [23,24].…”
Section: Introductionmentioning
confidence: 99%
“…If the injection variables are not selected correctly, it will be caused various defects such as separation and void in the sintered parts [19,20]. Also, an increase in injection temperature will cause binder components decomposition during the injection [21,22]. However, if the particle growth is prevented somehow during the sintering process, it is best to simultaneously increase the strength and decrease the particle size distributions [23,24].…”
Section: Introductionmentioning
confidence: 99%