2022
DOI: 10.1109/ted.2022.3209140
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Warpage Reduction and Thermal Stress Study of Dicing Process in Wafer-to-Wafer Bonding Fabrication

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Cited by 4 publications
(3 citation statements)
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“…It is important to note that in this case, the final step temperature was different from the poly-Si deposition temperature. Given the intricate nature of the physical and chemical processes, determining the stress-free temperature at the final step necessitated a trial and error approach, as elaborated in [ 16 ]. In this trial and error process, we explored six different stress-free temperatures, ultimately selecting the temperature that closely matched the experimental results.…”
Section: Methodsmentioning
confidence: 99%
See 2 more Smart Citations
“…It is important to note that in this case, the final step temperature was different from the poly-Si deposition temperature. Given the intricate nature of the physical and chemical processes, determining the stress-free temperature at the final step necessitated a trial and error approach, as elaborated in [ 16 ]. In this trial and error process, we explored six different stress-free temperatures, ultimately selecting the temperature that closely matched the experimental results.…”
Section: Methodsmentioning
confidence: 99%
“…It is important to note that in this case, the final step temperature was different from the poly-Si deposition temperature. Given the intricate nature of the physical and chemical processes, determining the stress-free temperature at the final step necessitated a trial and error approach, as elaborated in [16].…”
Section: Numerical Prediction Of Wafer Warpage At the Macro-scalementioning
confidence: 99%
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