2016
DOI: 10.1016/j.porgcoat.2016.09.016
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Water-based polyamide imide – nanoclay coating: Preparation, characterization, thermal stability and visible transparency

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Cited by 10 publications
(3 citation statements)
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“…The cast films obtained from 4 g emulsion of several thickness exhibit optical transparencies with no evidence of macroaggregates, as shown in Fig. ; suggesting good clay dispersion in the polymer matrix, similar finding has been reported by H. Naderi‐Samani et al and D. Murima et al .…”
Section: Resultssupporting
confidence: 87%
See 1 more Smart Citation
“…The cast films obtained from 4 g emulsion of several thickness exhibit optical transparencies with no evidence of macroaggregates, as shown in Fig. ; suggesting good clay dispersion in the polymer matrix, similar finding has been reported by H. Naderi‐Samani et al and D. Murima et al .…”
Section: Resultssupporting
confidence: 87%
“…Dongyan Wang et al polymerized PMMA‐modified MMT, and report an intercalated system, which increase their thermal stability and mechanical properties, using 0.60 g of organic clay. Also it has been reported a water‐based polyamide‐imide (PAI)/clay nanocomposites prepared using the solution intercalation technique, revealing that 1 wt% C20A was exfoliated and intercalated at 3 wt%, and with 5 wt% was flocculated, increasing their thermal stability. Sanit Sirapanichart et al report an increase of thermal stability, tensile strength and Young's modulus of poly(methyl methacrylate‐co‐butylacrylate)/organophosphate‐modified MMT composite films; without changes in their ductility properties and retaining their high transparency.…”
Section: Introductionmentioning
confidence: 99%
“…Starting with the latter category, performance improvements depend on the distribution and arrangement of the nanoclay in the polymer matrix. The effective exfoliation of nanoclays maximizes the hydrogen bonding between the layered nanoclay and PI chains resulting in better mechanical and thermal properties [16][17][18]. The thermal conductivity of PI which is in the order of 0.1 W m −1 K −1 cannot meet the requirement of fast heat conduction for advanced electronic devices.…”
Section: Introductionmentioning
confidence: 99%