Water immersion cooling of high power density electronics

Birbarah, Patrick; Gebrael, Tarek; Foulkes, Thomas; Stillwell, Andrew; Moore, Ann M.; Pilawa-Podgurski, Robert C. N.; Miljkovic, Nenad

doi:10.1016/j.ijheatmasstransfer.2019.118918

Cited by 133 publications

(23 citation statements)

References 28 publications

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“…A jet impingement technique is also considered to be an effective cooling approach for automotive inverter applications [82]. Moreover, immersion cooling allows high heat transfer coefficients (h > 2 kW/(m 2 •K)) to be achieved for the entire cooling system [83]. The basic principle of an immersion cooling technique is the submergence of the power modules in a thermally and not electrically conductive liquid [84].…”

Section: Classification Of Existing Cooling Techniquesmentioning

confidence: 99%

“…This method consists of placing heat sources with direct con to dissipate the generated heat (the principle is shown in Figure requirement for immersion cooling systems is to use an electrical ing fluid, which allows homogenous cooling. Equal thermal distr of increasing the reliability for high power density power device fluids suitable for immersion cooling are de-ionized water, m based fluids, and synthetic oil [83]. Immersion cooling, in gener or two-phase.…”

Section: Other Promising Cooling Approachesmentioning

confidence: 99%

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A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level

et al. 2021

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The development of electric vehicles (EVs) is an important step towards clean and green cities. An electric powertrain provides power to the vehicle and consists of a charger, a battery, an inverter, and a motor as the main components. Supplied by a battery pack, the automotive inverter manages the power of the motor. EVs require a highly efficient inverter, which satisfies low cost, size, and weight requirements. One approach to meeting these requirements is to use the new wide-bandgap (WBG) semiconductors, which are being widely investigated in the industry as an alternative to silicon switches. WBG devices have superior intrinsic properties, such as high thermal flux, of up to 120 W/cm2 (on average); junction temperature of 175–200 °C; blocking voltage limit of about 6.5 kV; switching frequency about 20-fold higher than that of Si; and up to 73% lower switching losses with a lower conduction voltage drop. This study presents a review of WBG-based inverter cooling systems to investigate trends in cooling techniques and changes associated with the use of WBG devices. The aim is to consider suitable cooling techniques for WBG inverters at different power levels.

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Section: Classification Of Existing Cooling Techniquesmentioning

confidence: 99%

Section: Other Promising Cooling Approachesmentioning

confidence: 99%

A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level

et al. 2021

View full text Add to dashboard Cite

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“…In previous experimental measurements carried out by the authors in a wind tunnel [16], it was confirmed that the flow that is being modeled is fully turbulent throughout the domain under consideration. The Reynolds-averaged Navier-Stokes (RANS) approach was adopted for numerically simulating the flow, and thus the mean flow was calculated by solving Equations (2) and 3:…”

Section: Mathematical Modeling 321 Turbulence Modelingmentioning

confidence: 99%

“…In order to solve the Reynolds stresses (ρu i u j ) and subsequently close the system of Equations (2) and 3, the standard k-ε model was applied [31]. Although the detailed models in Bengoechea et al [16,17] used the RSTM as a turbulence model, the standard k-ε model could be used in this work as the values of the pressure loss coefficients are those that best fit the results obtained in the detailed simulations (those that model the holes).…”

Section: Mathematical Modeling 321 Turbulence Modelingmentioning

confidence: 99%

“…The heat generated by the PCBs must be removed from each of these levels via an appropriate cooling strategy. There are several cooling strategies (liquid cooling [1,2], two-phase cooling [3] and spray cooling [4,5], among others), but the most commonly employed technique is air cooling using an axial fan to produce air movement for reasons of safety and availability. Problems arise as the axial fan is usually placed together with an electromagnetic compatibility (EMC) screen, which mainly plays the role of reducing electromagnetic interferences in the device but it also keeps dust from entering.…”

Section: Introductionmentioning

confidence: 99%

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Compact Model of a Screen under Fan-Induced Swirl Conditions Using a Porous Media Approach

et al. 2021

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A perforated plate in an electronic device is typically placed downstream of an axial fan (push cooling) in order to avoid electromagnetic interferences. Because of the swirling component in the flow approaching the screen, determining how the screen affects the flow pattern downstream of the screen is a challenge. It is important to understand this interaction, as the correct location of the electronic components will depend on the flow pattern (the components that dissipate more heat will be located where the maximum magnitude of the velocity is located). This work aims to present an approach of the flow pattern via a compact model based on three directional pressure loss coefficients. The values for the pressure loss coefficients are obtained through different correlations depending on the flow and geometric characteristics for the case that is being modeled. These correlations are obtained through an iterative process that compares different flow patterns obtained through different modeling strategies: the compact one that is presented in this paper and another detailed one, which was validated in previous works. Results show that if this compact model is used, an approximation of the flow pattern could be obtained with a huge decrease in the amount of time invested.

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Eco‐Friendly Materials for a Zero E‐Waste Society: Challenges and Opportunities in Engineering Plastics

Lee,

Huang,

Lee

et al. 2024

Advanced Sustainable Systems

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This review addresses the environmental challenges arising from the proliferation of plastic and electronic waste (E‐waste), driven by global economic and demographic expansion. Since the 1950s, the mass production of plastics has seriously threatened global sustainability, lacking effective post‐use management. E‐waste worsens the issue due to low recyclability and high toxicity. Resolving this requires improving biodegradability. The paper explores eco‐friendly biodegradable materials for a zero‐e‐waste society, focusing on multifunctional plastics in electronics, providing a comprehensive guide to material selection, and illustrating novel concepts through recent trials. The goal is fully biodegradable electronics, but transitioning from conventional material systems is complex. Notably, rendering engineering plastics in electronics biodegradable surpasses simply substituting conventional plastics. Thus, it is delved into various research initiatives focused on biodegradable materials for electronics, highlighting a systematic approach toward creating a fully integrated, biodegradable electronic system. This includes exploring the mechanisms of biodegradation and the integration of printed circuit boards (PCBs), a critical component in electronics. Achieving this represents a challenging but promising step toward a sustainable electronic future.

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Water immersion cooling of high power density electronics

Cited by 133 publications

References 28 publications

A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level

A Thorough Review of Cooling Concepts and Thermal Management Techniques for Automotive WBG Inverters: Topology, Technology and Integration Level

Compact Model of a Screen under Fan-Induced Swirl Conditions Using a Porous Media Approach

Eco‐Friendly Materials for a Zero E‐Waste Society: Challenges and Opportunities in Engineering Plastics

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