Water-induced effect on femtosecond laser layered ring trepanning in silicon carbide ceramic sheets using low-to-high pulse repetition rate

Ren, Na; Fu-qiang, Gao; Wang, Houxiao; Xia, Kaibo; Song, Shiwen; Yang, Huayu

doi:10.1016/j.optcom.2021.127040

Cited by 14 publications

(3 citation statements)

References 24 publications

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“…The assistance of liquid media can help reduce the re-deposition of debris, obtain a smooth sidewall surface, and obtain structures with high material removal rates [100,101]. Ren et al [102] used an underwater femtosecond laser to process craters in a layered circular pattern by adjusting the focus position. This technology can significantly increase crater depth, reduce adverse thermal effects, surface roughness, and recast layers.…”

Section: Underwater Laser Composite Processing Technologymentioning

confidence: 99%

A Review of Femtosecond Laser Processing of Silicon Carbide

Wang,

Zhang,

Chen

et al. 2024

Micromachines

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Silicon carbide (SiC) is a promising semiconductor material as well as a challenging material to machine, owing to its unique characteristics including high hardness, superior thermal conductivity, and chemical inertness. The ultrafast nature of femtosecond lasers enables precise and controlled material removal and modification, making them ideal for SiC processing. In this review, we aim to provide an overview of the process properties, progress, and applications by discussing the various methodologies involved in femtosecond laser processing of SiC. These methodologies encompass direct processing, composite processing, modification of the processing environment, beam shaping, etc. In addition, we have explored the myriad applications that arise from applying femtosecond laser processing to SiC. Furthermore, we highlight recent advancements, challenges, and future prospects in the field. This review provides as an important direction for exploring the progress of femtosecond laser micro/nano processing, in order to discuss the diversity of processes used for manufacturing SiC devices.

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Section: Underwater Laser Composite Processing Technologymentioning

confidence: 99%

A Review of Femtosecond Laser Processing of Silicon Carbide

Wang,

Zhang,

Chen

et al. 2024

Micromachines

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“…[36] Researchers have used WAFLD to achieve the preparation of high-quality micro-holes and verify the advantages of this method in femtosecond laser processing. [37] The femtosecond laser ablation rate depends heavily on the water film thickness. [38] When the laser passes through the water layer to reach the processing surface, the refraction and scattering effect of the water will impact the quality and focus state of the laser beam.…”

Section: Wafldmentioning

confidence: 99%

Femtosecond Laser Fabrication of Microchannels in Transparent Hard Materials

Wang

et al. 2023

Adv Materials Technologies

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The excellent characteristics of transparent hard materials such as high hardness, high transparency, corrosion resistance, and high temperature resistance enable their applications in microfluidic substrates even in harsh environments. Microchannels are important parts in microfluidic systems, and the preparation of microchannel structures in transparent hard materials deserves further in‐depth study. The traditional processing method is contact processing with large thermal influence and low processing efficiency, so it is impossible to obtain complex microchannels with high quality and high aspect ratio. The femtosecond laser processing is a non‐contact processing approach with no thermal damage, high processing accuracy, and easy to form complex microchannels, making it the best choice for processing microchannels in transparent hard materials. This work reviews the recent advances in femtosecond laser processing of transparent hard materials to form microchannel structures, focusing on the reaction mechanism, processing methods, and the obtained microchannel structures, including surface microchannels, 2D microchannels, and 3D microchannels. Furthermore, the application of microchannel structure in microfluidic field, including optical inspection and biochemical reaction, is also described.

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“…Moreover, the solution flow caused by bubbles and the increase in plasma recoil pressure in water could significantly improve the material removal rate. In a femtosecond fibre laser-drilling experiment on SiC ceramic sheets [21], the microfluidic effect of the water solution reduced the overall thermal stress by homogenising the transient temperature gradient. The local bubble cavitation effect of water near the hole wall could also effectively reduce the thermal stress and improve the surface quality and uniformity of the bore surface.…”

Section: Introductionmentioning

confidence: 99%

Improving the Quality of Laser Drilling by Assisted Process Methods of Static Solution and Mist Blowing

Tao,

Wang,

et al. 2024

Micromachines

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The use of static solution-assisted laser drilling can effectively improve hole roundness, decrease taper angle, and reduce recast layer thickness and hole wall slag adhesion. However, the enormous energy of the laser will evaporate the solution to form a suspension droplet and reduce the quality and efficiency of laser drilling. To deal with this defect, the mist-blowing method was used to reduce the influence of droplets on the taper angle and recast layer. In this work, the effect of wind speed on drilling quality was examined, and laser drilling in air, water, and NaCl solution was carried out to analyse the effect of solution composition on hole wall morphology. The results showed that a speed fan with a proper wind speed that disperses the droplets formed in the processing area can significantly reduce the refraction and scattering of the laser, and the taper angle and roundness of the drilling hole were also reduced by 15.6% and improved by 2.4%, respectively, under the wind speed of 2 m/s. The hole wall morphology showed a thicker recast layer and cracking in air, while it was thinner in water and there was little or no layer in the NaCl solution in the same current. When drilling in NaCl, the taper angle and roundness of the drilling hole were reduced by 4.13% and improved by 2.11%, respectively, compared to water. Due to the mechanical effect of the laser in the NaCl solution, the impact force on the material was much greater than that in water. The solution cavitation effect, generated by the absorption of laser energy, caused an explosive impact on the molten material adhered to the surface of the hole wall. Above all, drilling in the NaCl solution with a current of 200 A and a wind speed of 2 m/s was the optimal condition for obtaining the best processing quality.

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Water-induced effect on femtosecond laser layered ring trepanning in silicon carbide ceramic sheets using low-to-high pulse repetition rate

Cited by 14 publications

References 24 publications

A Review of Femtosecond Laser Processing of Silicon Carbide

A Review of Femtosecond Laser Processing of Silicon Carbide

Femtosecond Laser Fabrication of Microchannels in Transparent Hard Materials

Improving the Quality of Laser Drilling by Assisted Process Methods of Static Solution and Mist Blowing

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