Waterproof sensor system for simultaneous pressure and hot-film flow measurements

Schwerter, Martin; Leester-Schädel, Monika; Dietzel, Andreas

doi:10.1016/j.sna.2017.02.010

Cited by 13 publications

(5 citation statements)

References 19 publications

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“… Schematic cross-sections of the hermetic CSP ( top ) in comparison with the earlier adhesive package sensor concept [ 6 , 7 , 8 ] ( bottom ). …”

Section: Figurementioning

confidence: 99%

“…Although silicon vias have been shown to eliminate wire bonds [ 5 ], fragile and active sensor elements on the sensor’s exterior still restrict their utilization to laboratory conditions. The authors have previously presented a surface flush pressure sensor with active elements enclosed, making it suitable for the harsh environment of a water tunnel and real-world applications [ 6 , 7 , 8 ]. This sensor design, however, utilizes adhesive bonding, which cannot be considered as a hermetic enclosure of the reference pressure volume.…”

Section: Introductionmentioning

confidence: 99%

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Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration

Haus

Schwerter

Schneider

et al. 2021

Sensors

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Current research in the field of aviation considers actively controlled high-lift structures for future civil airplanes. Therefore, pressure data must be acquired from the airfoil surface without influencing the flow due to sensor application. For experiments in the wind and water tunnel, as well as for the actual application, the requirements for the quality of the airfoil surface are demanding. Consequently, a new class of sensors is required, which can be flush-integrated into the airfoil surface, may be used under wet conditions—even under water—and should withstand the harsh environment of a high-lift scenario. A new miniature silicon on insulator (SOI)-based MEMS pressure sensor, which allows integration into airfoils in a flip-chip configuration, is presented. An internal, highly doped silicon wiring with “butterfly” geometry combined with through glass via (TGV) technology enables a watertight and application-suitable chip-scale-package (CSP). The chips were produced by reliable batch microfabrication including femtosecond laser processes at the wafer-level. Sensor characterization demonstrates a high resolution of 38 mVV−1 bar−1. The stepless ultra-smooth and electrically passivated sensor surface can be coated with thin surface protection layers to further enhance robustness against harsh environments. Accordingly, protective coatings of amorphous hydrogenated silicon nitride (a-SiN:H) and amorphous hydrogenated silicon carbide (a-SiC:H) were investigated in experiments simulating environments with high-velocity impacting particles. Topographic damage quantification demonstrates the superior robustness of a-SiC:H coatings and validates their applicability to future sensors.

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“… Schematic cross-sections of the hermetic CSP ( top ) in comparison with the earlier adhesive package sensor concept [ 6 , 7 , 8 ] ( bottom ). …”

Section: Figurementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration

Haus

Schwerter

Schneider

et al. 2021

Sensors

Self Cite

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“…The novel approach, in this case, was the integration of sensor and associated subsystems directly into the wall unlike other MEMS sensors reported earlier in literature. An epoxy resin embedded and waterproof shielded pressure and wall shear sensor has been developed and presented by Schwerter et al (2017a) for harsh environments. The active sensing elements are arranged on the inner side of the sensor in contrast to the common piezoresistive chips to sustain the fast flow of liquid.…”

Section: Aerospace Applicationsmentioning

confidence: 99%

A review of principles of MEMS pressure sensing with its aerospace applications

Javed

Mansoor

Shah

2019

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Purpose Pressure, being one of the key variables investigated in scientific and engineering research, requires critical and accurate measurement techniques. With the advancements in materials and machining technologies, there is a large leap in the measurement techniques including the development of micro electromechanical systems (MEMS) sensors. These sensors are one to two orders smaller in magnitude than traditional sensors and combine electrical and mechanical components that are fabricated using integrated circuit batch-processing technologies. MEMS are finding enormous applications in many industrial fields ranging from medical to automotive, communication to electronics, chemical to aviation and many more with a potential market of billions of dollars. MEMS pressure sensors are now widely used devices owing to their intrinsic properties of small size, light weight, low cost, ease of batch fabrication and integration with an electronic circuit. This paper aims to identify and analyze the common pressure sensing techniques and discuss their uses and advantages. As per our understanding, usage of MEMS pressure sensors in the aerospace industry is quite limited due to cost constraints and indirect measurement approaches owing to the inability to locate sensors in harsh environments. The purpose of this study is to summarize the published literature for application of MEMS pressure sensors in the said field. Five broad application areas have been investigated including: propulsion/turbomachinery applications, turbulent flow diagnosis, experimentalaerodynamics, micro-flow control and unmanned aerial vehicle (UAV)/micro aerial vehicle (MAV) applications. Design/methodology/approach The first part of the paper deals with an introduction to MEMS pressure sensors and mathematical relations for its fabrication. The second part covers pressure sensing principles followed by the application of MEMS pressure sensors in five major fields of aerospace industry. Findings In this paper, various pressure sensing principles in MEMS and applications of MEMS technology in the aerospace industry have been reviewed. Five application fields have been investigated including: Propulsion/Turbomachinery applications, turbulent flow diagnosis, experimental aerodynamics, micro-flow control and UAV/MAV applications. Applications of MEMS sensors in the aerospace industry are quite limited due to requirements of very high accuracy, high reliability and harsh environment survivability. However, the potential for growth of this technology is foreseen due to inherent features of MEMS sensors’ being light weight, low cost, ease of batch fabrication and capability of integration with electric circuits. All these advantages are very relevant to the aerospace industry. This work is an endeavor to present a comprehensive review of such MEMS pressure sensors, which are used in the aerospace industry and have been reported in recent literature. Originality/value As per the author’s understanding, usage of MEMS pressure sensors in the aerospace industry is quite limited due to cost constraints and indirect measurement approaches owing to the inability to locate sensors in harsh environments. Present work is a prime effort in summarizing the published literature for application of MEMS pressure sensors in the said field. Five broad application areas have been investigated including: propulsion/turbomachinery applications, turbulent flow diagnosis, experimental aerodynamics, micro-flow control and UAV/MAV applications.

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“…[11][12][13][14][15] In contrast to aerospace, rail transit has its own aerodynamic peculiarities, such as trains with high length/diameter ratios, strong coupling effects between trains and the ground, trains passing through various bridges and tunnels, many crossings between two trains running on open lines or in tunnels, and trains running in across-wind, rain, or snow. [16,17] These peculiarities of aerodynamics present different pressure amplitudes on the surface air flow field of the train, expect for the corresponding sensors with high sensitivity in the target linear range. [18][19][20][21][22] However, single-type MEMS-based pressure sensors tend to have a single work range, and their linear range is difficult to adjust.…”

Section: Introductionmentioning

confidence: 99%

Waterproof, Anti‐Impacted, and Ultrathin Carbon‐Based Air Pressure Sensors Toward Aerodynamic Tests on High‐Speed Trains

Chen

Wang

et al. 2022

Adv Eng Mater

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Air pressure sensors play a crucial role in aerodynamic tests on high‐speed trains, especially when the aerodynamic problems become more significant when the speed of high‐speed trains increases. The air pressure sensors used for aerodynamic testing of high‐speed trains are currently based on microelectromechanical systems (MEMS), which are thick, difficult to adjust linear range, and easily damaged by overloading force and water, thus cannot satisfy all‐weather train aerodynamic monitoring. Herein, a flexible ultrathin air pressure sensor for aerodynamic testing of high‐speed trains is reported; this sensor is based on a sensing material of carbon fiber beams and a sealed microchamber structure. The microchamber structure model allows the sensor to achieve high sensitivity in the target linear range by adjusting the initial internal pressure of the sealed microchamber. Meanwhile, the sealed microchamber structure enables the sensor to be waterproof and anti‐impacted. The sensor can work in water for at least 500 min and remain undamaged after being run over by a car with a weight of approximately 1550 kg. Furthermore, this air pressure sensor has been successfully applied in real‐time train surface pressure monitoring and shows the fantastic perspective for sensors toward aerodynamic tests on the high‐speed trains.

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Waterproof sensor system for simultaneous pressure and hot-film flow measurements

Cited by 13 publications

References 19 publications

Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration

Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration

A review of principles of MEMS pressure sensing with its aerospace applications

Waterproof, Anti‐Impacted, and Ultrathin Carbon‐Based Air Pressure Sensors Toward Aerodynamic Tests on High‐Speed Trains

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