In this work we present experimental results on the radiation hardness of InP based Photonic Integrated Circuits (PICs) fabricated in a multi-project wafer through an open access platform. The PIC includes different types of building blocks: semiconductor optical amplifiers (SOA), waveguides, electro-optical phase modulators (EOPM), multi-mode interference couplers and photodiodes (PD). Three chips were submitted to gamma radiation up to 106 krad in four steps and another three to proton radiation up to 1.5 x 1011 p+/cm2. The effects of the radiation were evaluated by measuring on-wafer the power-current-voltage (P-I-V) characteristics and emission spectra of several tunable four-section Distributed Bragg Reflector (DBR) lasers. The P-I-V characteristics measured before radiation showed kinks corresponding to modal changes and stable regions with single longitudinal mode emission. After the radiation some changes were observed: i) the value of the threshold current in some of the lasers, either increasing or decreasing its value; ii) slightly different emission wavelength and evolution of the modal jumps with current. However, these changes were not systematic in all devices, and they were not dependent of the radiation dose. In consequence, they were attributed to the lack of reproducibility of the on-wafer measurements and the high sensitivity of the modal selection to temperature changes in these DBR lasers. In conclusion, the building blocks of the PICs involved in the DBR laser (SOA, EOM, waveguide, PD) can be considered radiation hard up to the levels in the tests, which were typical for space applications.