Wear of diamond grinding wheel in ultrasonic vibration-assisted grinding of silicon carbide

Ding, Kai; Fu, Yucan; Su, Honghua; Gong, Xing; Wu, Kaigui

doi:10.1007/s00170-014-5625-x

Cited by 69 publications

(38 citation statements)

References 19 publications

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“…This explains qualitatively the more significant fracture wear of the brazed CBN grains. Further investigations [16][17][18][19][20][21] have explored that grain wear caused by macro-fracture at the grain-bond junction reduces the wheel life significantly, which should be minimized; but certain micro-fracture in the vertex region of a grain can enhance the sharpness of a grinding wheel.…”

Section: Introductionmentioning

confidence: 99%

Stress characteristics and fracture wear of brazed CBN grains in monolayer grinding wheels

Ding

Zhu

Zhang

et al. 2015

Wear

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Section: Introductionmentioning

confidence: 99%

Stress characteristics and fracture wear of brazed CBN grains in monolayer grinding wheels

Ding

Zhu

Zhang

et al. 2015

Wear

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“…It is particularly interesting for the fine-grinding of geometrically demanding geometries and surfaces. It could be proven that due to reduced grinding forces a smaller web width can be achieved as well as lower stress in terms of sub-surface damages in the glass surface [6,7].…”

Section: Ultrasonic-assisted Grindingmentioning

confidence: 99%

New Process Chain for the Production of Complex Freeforms

Bliedtner

Henkel²,

Schwager³

et al. 2018

Optik & Photonik

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Freeform optics enable completely new solutions in optical design for many different optical applications.Complex optical systems usually need a variety of multiple classic spherical surfaces to fulfill their function. The usage of a freeform surface instead makes it possible to replace some of these spherical surfaces by only one freeform element. Therefore, it is possible to build optical systems that are more compact and lighter than existing ones. However, these new possibilities also lead to new challenges regarding fabrication and assembly of the freeform components. Therefore, an efficient production of such elements needs improvement of existing or development of new manufacturing technologies and process chains. This paper describes a new fabrication approach focused on freeform optics by introducing a process chain consisting of an ultrasonic-assisted grinding process, an ultrafine grinding method using novel resin bond tools and a CO 2 laser polishing process for final surface smoothing.Nowadays, modern high-precision optical systems are applied in a great variety of fields such as medical engineering, automotive engineering, semiconductor and sensor technology, machine and plant construction. The increasing integration of functions into such systems requires, besides optical components, also very complex mechanical, electrical, sensory as well as IT-components. This has led to rising demands on the production development process. The high integration density and complexity of this product group focuses more and more on interdisciplinary cooperation of various experts.The requirements on the optical components are growing in terms of achievable shape and precision, too. Their fabrication is increasingly characterized by the application of aspheric and freeform-optical surfaces. Conventional process chains are not sufficient for these requirements. New continuous process chains, particularly for the fab-

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“…Although prepared by near net forming technology, the SiC ceramic components still need machining to meet assembling or application requirements [5]. Because of the superior properties, grinding or ultrasonic assisted grinding (UAG) process with a diamond wheel is always adopted for SiC ceramic [6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Experimental studies on matching performance of grinding and vibration parameters in ultrasonic assisted grinding of SiC ceramics

Ding

et al. 2016

Int J Adv Manuf Technol

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Ultrasonic assisted grinding (UAG) is an outstanding technology suitable to machine advanced ceramics. During UAG, the effect of ultrasonic vibration on grinding process is mainly determined by matching performance between grinding and vibration parameters in theory. However, this problem is still lack of deep study. With an objective to study the matching performance deeply, conventional grinding (CG) and UAG tests were conducted. The effects of grinding parameters on grinding force, ground surface profile wave, and ground surface roughness between UAG and CG were studied. The results showed that the grinding force, ground surface profile wave height, and ground surface roughness during UAG were reduced in varying degrees compared to CG. Additionally, the reduction percentage that means the effect of ultrasonic vibration on grinding process decreased significantly with increasing grinding speed while affected slightly by increasing of feedrate and grinding depth. To deeply analyze this variety law of the ultrasonic vibration effect during UAG, a matching performance equation referred to grinding wheel diameter, grinding, and vibration parameters is proposed. When the grinding speed increases from 1.26 to 31.5 m/s for feedrate of 100 mm/min and grinding depth of 5 μm, reduction percentage in grinding force for UAG compared to CG (K F ) decreases from about 20 to 4 % and in ground surface roughness (K R ) decreases from 35 to 4 %. With regard to the average difference height (Δh) between the UAG and CG profile waves, it decreases from 2.77 μm almost to zero.

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Wear of diamond grinding wheel in ultrasonic vibration-assisted grinding of silicon carbide

Cited by 69 publications

References 19 publications

Stress characteristics and fracture wear of brazed CBN grains in monolayer grinding wheels

Stress characteristics and fracture wear of brazed CBN grains in monolayer grinding wheels

New Process Chain for the Production of Complex Freeforms

Experimental studies on matching performance of grinding and vibration parameters in ultrasonic assisted grinding of SiC ceramics

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