2021
DOI: 10.1021/acsaelm.0c01072
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Wearable Devices Made of a Wireless Vertical-Type Light-Emitting Diode Package on a Flexible Polyimide Substrate with a Conductive Layer

Abstract: In this study, wearable devices are made using wireless vertical-type light-emitting diode (LED) packages of a transparent conductive film coated on flexible colorless polyimide (PI) with 50 μm thickness. The low-stress ultrathin transparent conductive multilayers are deposited on the PI using high-power impulse magnetron sputtering at 65 °C. It can be used as the electrode in an ultraflexible photoplethysmography (PPG) biosensor. The nearly stress-free multilayer, consisting of a Ag layer with 20 nm thickness… Show more

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Cited by 12 publications
(3 citation statements)
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“…However, PI is usually not colorless and does not recover under tremendous pressure, limiting its application in wearable, transparent, flexible sensors [35]. The advent of colorless polyimide (CPI) [36,37] has broadened the production of high-performance flexible sensors.…”
Section: Thermosetting Polymersmentioning
confidence: 99%
“…However, PI is usually not colorless and does not recover under tremendous pressure, limiting its application in wearable, transparent, flexible sensors [35]. The advent of colorless polyimide (CPI) [36,37] has broadened the production of high-performance flexible sensors.…”
Section: Thermosetting Polymersmentioning
confidence: 99%
“…Compared with inorganic oxide materials, polymer materials have attracted much attention due to their advantages that other inorganic materials cannot surpass, especially low density, wear resistance, corrosion resistance, and high flexibility 15 , 16 . Among them, polyimide (PI) has strong mechanical and chemical stability, high electrical reliability, exhibits unique electrical properties, and high flexibility in a variety of wearable devices 17 , 18 . In addition, PI that combines the above advantages is easy to synthesize and hence has broad potential in research and practical applications, either as functional materials or as supporting substrates 19 .…”
Section: Introductionmentioning
confidence: 99%
“…Metal–polymer thin films show extreme resilience to thermal and mechanical cycles, allowing for their application in harsh environments, and are extensively used for thermal radiation insulation of satellites, wearable devices, and flexible electronics. Additionally, metallic films exhibit extreme adhesion on Kapton-based polymeric substrates without the need for additional adhesion layers. , Their vanishing thickness allows for low-material usage, lightweight, and cost-effective and large-scale applications in challenging environments. Recent studies highlight the desirability of metal–polymer films for enhancement of mechanical properties.…”
Section: Introductionmentioning
confidence: 99%