Resist-based
lithographic tools, such as electron beam (e-beam)
and photolithography, drive today’s state-of-the-art nanoscale
fabrication. However, the multistep nature of these processes, expensive
resists, and multiple other consumables limit their potential for
cost-effective nanotechnology. Here, we report a one-step, resist-free,
and scalable methodology for directly structuring thin metallic films
on flexible polymeric substrates via e-beam patterning. Controlling
e-beam dose results in nanostructures as small as 5 nm in height with
a sub-micrometer lateral resolution. We structure nanoscale thick
films (100 nm) of Al, TiN, and Au on standard Kapton tape to highlight
the universal use of our nanopatterning methodology. Further, we utilize
direct e-beam writing to create various high-resolution biomimetic
surfaces directly onto ceramic thin films. In addition, we assemble
architectured mechanical metamaterials comprising crack “traps”,
which confine cracks and prevent overall material/device failure.
Such a resist-free lithographic tool can reduce fabrication cost dramatically
and may be used for different applications varying from biomimetic
and architectured metamaterials to strain-resilient flexible electronics
and wearable devices.