A novel 9,9′-spirobifluorene derivative bearing thermally cross-linkable vinyl groups (V1382) was developed as a hole-transporting material for perovskite solar cells (PSCs). After thermal cross-linking, a smooth and solvent-resistant threedimensional (3D) polymeric network is formed such that orthogonal solvents are no longer needed to process subsequent layers.Copolymerizing V1382 with 4,4′-thiobisbenzenethiol (dithiol) lowers the cross-linking temperature to 103 °C via the facile thiol− ene "click" reaction. The effectiveness of the cross-linked V1382/dithiol was demonstrated both as a hole-transporting material in p−i−n and as an interlayer between the perovskite and the hole-transporting layer in n−i−p PSC devices. Both devices exhibit better power conversion efficiencies and operational stability than devices using conventional PTAA or Spiro-OMeTAD hole-transporting materials.