Ion irradiation and implantation are used extensively for inducing functionalities and engineering of nanostructures for diverse applications in the nanotechnology domain. Nanostructures, under ion irradiations, exhibit distinct transformations in contrast to their bulk counterparts due to the nanostructure dimensions comparable to collision cascade. Tensile, compressive stresses can be developed in the lattice atoms under ion irradiations, inducing plastic deformation, which in turn can be used for controlled manipulation at nanoscale, thus providing opportunities for extended functionality and strain engineering of nanostructures. Silicon (Si) nanostructures, with a high index and large band gap, offer unique light-matter interactions for optical applications such as color filtering etc. [1], [2] Conventional lithography methods such as electron beam lithography (EBL),however, consist of multiple steps requiring mask preparation, resist development, dry/wet etching etc. and the experimental realization of 3D, complex features for extended functionalities becomes especially challenging due to the design intricacy, with limitations on the feature size and aspect ratio.