WEDM process optimization of sintered structural ceramic sample by using fuzzy-MPCI technique

Pramanick, Ayan; Mandal, S.; Dey, Partha Pratim; Das, Pankaj

doi:10.1016/j.matpr.2020.10.350

Cited by 4 publications

(3 citation statements)

References 27 publications

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“…A main condition for carrying out WEDM is that the machined material must be electrically conductive. However, different WEDM works on dielectric materials have been carried out; for instance, electrical discharge machining of oxide ceramic was made [40,41]. In this way, WEDM offers reasonable attention for the machining of electroconductive ceramic materials such as SiC-TiB 2 -TiC, regardless of their hardness and the complex profiles that can be obtained, even under further automation.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the WEDM Parameters’ Influence on the Recast Layer Thickness of Spark Plasma Sintered SiC-TiB2-TiC Ceramic

Solís Pinargote,

Malakhinsky,

Soe

et al. 2023

Coatings

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The influence of WEDM parameters (Spark gap voltage, Pulse-on time, Spark frequency, and Wire speed) on the recast layer thickness and surface roughness of Spark Plasma Sintered SiC-TiB2-TiC ceramic composite was investigated. For this, an orthogonal L9 Taguchi design was used, and grey relational analysis was carried out for multi-response WEDM parameter optimization in order to determine the minimum RLT and SR. It was noticed that for RLT, the Pulse-on time was observed as the most significant process parameter, followed by Spark gap voltage. On the other hand, Spark frequency and Wire speed had no significance for RLT. Moreover, Spark frequency was observed as the most significant process parameter, followed by Pulse-on time and Spark gap voltage, while Wire speed had a negligible effect on SR. It was found that at optimal process parameters (U = 48V; Ton = 1.0 µs; f = 10 kHz; q = 8 m/min), we obtained an RLT of 3.16 µm and an SR of Ra = 0.847 µm. The confirmation test showed a decrease in RLT and SR by 43.67% and 7.12%, respectively, in comparison to the initial machining conditions.

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Section: Introductionmentioning

confidence: 99%

Investigation of the WEDM Parameters’ Influence on the Recast Layer Thickness of Spark Plasma Sintered SiC-TiB2-TiC Ceramic

Solís Pinargote,

Malakhinsky,

Soe

et al. 2023

Coatings

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“…Slicing is the forming process of the substrate, which is related to the surface quality of the Si 3 N 4 ceramics substrate and thus affects the subsequent processing costs. Si 3 N 4 ceramics slices are mainly processed by wire electrical discharge machining (WEDM) and laser cutting [ 4 , 5 , 6 ]. WEDM wire cutting of hard-brittle materials has many applications, but when applied to non-conductive Si 3 N 4 ceramics, requires the addition of an auxiliary electrode, resulting in a complex slicing process [ 7 ].…”

Section: Introductionmentioning

confidence: 99%

Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

Zhang,

Gao,

Zhang

et al. 2023

Micromachines

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For the slicing of superhard silicon nitride ceramics, diamond wire sawing technology has great potential for application, and its slicing surface characteristics are an important indicator of cutting quality. In this paper, the sawing experiments of silicon nitride ceramics were carried out within the range of industrial processing parameters of diamond wire sawing (saw wire speed: 800–1600 m/min, workpiece feed speed 0.1–0.4 mm/min). The effects of cutting parameters on the surface morphology, surface roughness and waviness of the as-sawn slices were analyzed. The results show that within the range of sawing parameters for industrial applications, the material on the diamond wire as-sawn surface of silicon nitride ceramics is removed mainly in a brittle mode, with the slice morphology showing brittle pits and regularly distributed wire marks in the 20–55 μm scale range. The surface roughness of the slices along the workpiece feed direction ranges from 0.27 to 0.38 μm and decreases with increasing saw wire speed and decreasing feed rate. The surface waviness ranges from 0.09 to 0.21 μm, which is in good agreement with the changing trend of the sliced-surface roughness. The results of the study provide an experimental reference for promoting the engineering application of diamond wire sawing technology to the processing of silicon nitride ceramic slices.

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“…[6,7]) indicate that the speed of wire feeding into the workspace is also important in stabilizing machining -the lower the speed, the higher the probability of wire breakage which forces the machining to slow down and the poorer the quality of the machined surface (by lower uniformity of electrode-material contact) [10]. On the other hand, high wire tension leads to more straightness in the wire, which helps to stabilize the electrical voltage between the two electrodes and create more heat flux, resulting in increased erosion of the material at the corners and thus dimensional errors (especially corner errors) [9]. This paper focuses on the analysis of the WEDM cutting process, in terms of the influence of individual parameters on the number of occurrences and sizes of erosion craters on the machined surface.…”

Section: Introductionmentioning

confidence: 99%

Metallographic Examination of Surface Layer After Electrical Discharge Machining

Sokołowski¹,

Łomozik²,

Bąkowski³

2022

IJMMT

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This paper presents analysis of the influence of selected electrical parameters of hollowing on the state of the surface layer after electrical discharge machining (EDM). Namely, paper focuses on the analysis of the EDM cutting process, in terms of the influence of individual parameters on the number of occurrences and sizes of erosion craters on the machined surface. The basic parameters include electrical pulse discharge time, electrical discharge pause time, voltage, current amplitude and servo voltage. The initial values of the mentioned parameters were selected based on technology tables provided by the machine manufacturer and on the basis of own empirical tests. The tests were carried out according to static determined poliselective experimental plan (Hartley plan). Analysis of the machined surface was carried out using a scanning microscope (SEM) and an optical microscope. Quantitative metallographic analysis was used to determine the stereological features of erosion craters occurring on the surface of the machined material. The results were illustrated by means of three-dimensional graphs. The presented studies show a significant effect of electrical parameters of EDM on the quality of the machined surface, i.e. the number of occurrences and diameter of erosion craters. The research presents an approach based on mathematical modelling of electrical discharge machining. This approach can form the basis for developing methods of modeling technological processes and optimizing their parameters.

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WEDM process optimization of sintered structural ceramic sample by using fuzzy-MPCI technique

Cited by 4 publications

References 27 publications

Investigation of the WEDM Parameters’ Influence on the Recast Layer Thickness of Spark Plasma Sintered SiC-TiB2-TiC Ceramic

Investigation of the WEDM Parameters’ Influence on the Recast Layer Thickness of Spark Plasma Sintered SiC-TiB2-TiC Ceramic

Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

Metallographic Examination of Surface Layer After Electrical Discharge Machining

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