Wet Chemical Cleaning for Industrial Application

Surface Cleaning and Passivation Technologies for the Fabrication of High-Efficiency Silicon Heterojunction Solar Cells

“…Improvements to the RCA cleaning technique, initially developed for integrated circuits [36], have already been implemented in solar cell manufacturing. However, the large amount of cleaning steps and the significant chemical usage in the commonly employed RCA cleaning technique (RCA1, rinsing, diluted hydrofluoric acid (DHF), rinsing; RCA2, rinsing, DHF, rinsing, and drying) render it impractical for mass production [38]. Simplified variations of such cleaning procedures were investigated to fulfill the demands of cleaning efficiency and industrial output [39,40].…”

“…H 2 O 2 is involved in pre-and post-texturing cleaning and accounts for about 50% of the total cost of typical chemicals [38]. As shown in Figure 3, H 2 O 2 in the RCA cleaning process can be avoided by using ozone-based cleaning.…”

“…[50]. Compared with traditional RCA wet-chemical cleaning, the currently widely used ozone cleaning method can reduce the cost by 13%, and further optimization of the ozone cleaning process can reduce the cost by 30% [38].…”

“…[50]. Compared with traditional RCA wet−chemical cleaning, the currently widely used ozone cleaning method can reduce the cost by 13%, and further optimization of the ozone cleaning process can reduce the cost by 30% [38]. Ozone−based cleaning is regarded as a compelling substitute for RCA cleaning due to its potential to effectively eliminate surface contaminants, decrease the requirement for chemicals, lower wastewater treatment costs, and reduce cleaning time.…”