Wettability and bonding of graphite by Sn0.3Ag0.7Cu-Ti alloys

Wang, Fu; Hu, Shengpeng; Song, Xiaoguo; Li, J.X.; Cao, Jian; Feng, Jicai; Wang, G.D.

doi:10.1016/j.carbon.2017.06.030

Cited by 71 publications

(17 citation statements)

References 50 publications

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“…Some dark phase distributed in the middle of the solidified droplets, as clearly observed in Figure F. The dark phase in the droplets were identified as Ti 6 Sn 5 by EDS analysis, similar results were reported by Fu et al . The distribution area of Ti–Sn intermetallic compounds (IMCs) increased with mounting Ti content and the droplets morphologies were approximate to conical shape.…”

Section: Resultssupporting

confidence: 86%

“…But the joints shear strength decreased with 4 wt% Ti filler due to the effect of Ti–Sn reaction. The similar result could also be found in brazing of graphite/graphite using Sn‐based filler . So, it is important to study the influence of Ti content on the wettability of Sn‐based alloy to support the design of active filler in brazing SiC/SiC.…”

Section: Introductionsupporting

confidence: 66%

“…In recent years, among lead‐free solders, Sn‐based fillers have attracted great interest for their low cost and nontoxic . Sn‐based filler have obtained connected joints in brazing alumina, graphite, SiO 2 to themselves or to metals . Kang et al studied the wetting and brazing of alumina by Sn0.3Ag0.7Cu‐Ti (SAC‐Ti), drawing conclusions that the addition of Ti could improve the wettability of SAC‐Ti fillers on alumina and the highest joint shear strength of 28.6 MPa was obtained using 2 wt% Ti content filler.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic

Song

et al. 2018

J Am Ceram Soc

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The wetting behavior of Sn0.3Ag0.7Cu (SAC) filler with the addition of Ti on SiC ceramic was investigated using sessile drop method. SiC/SiC was brazed by SAC‐Ti filler with different Ti content at 1223 K (950°C) for 10 minutes. The wettability of SAC‐Ti filler on SiC was significantly enhanced with the addition of Ti. The contact angle decreased at first and then increased with increasing Ti content. The lowest contact angle of 9° was obtained with SAC‐1.5Ti (wt%) filler. When Ti content further increased to 2.0 wt%, the contact angle increased, due to the intense reaction of Ti–Sn. The reaction between Ti and SiC controlled the wetting behavior of SAC‐Ti on the SiC substrate and the reaction products such as TiC and Ti5Si3 were formed. The wetting of SAC‐Ti on SiC was reaction‐controlled. Interfacial reaction products TiC and Ti5Si3 were observed. The wetting activation energy in spreading stage was calculated to be 129.3 kJ/mol. Completely filled SiC/SiC joints were obtained using the filler with Ti content higher than 0.5 wt%. The fillet height increased firstly then decreased with mounting Ti content. The shear strength of joints increased first with the addition of Ti then decreased with Ti content increasing to 2.0 wt%. The highest shear strength of 35.7 MPa was obtained with SAC‐1.5 Ti (wt%) filler.

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Section: Resultssupporting

confidence: 86%

Section: Introductionsupporting

confidence: 66%

Section: Introductionmentioning

confidence: 99%

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Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic

Song

et al. 2018

J Am Ceram Soc

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“…It can be deduced that the introduction of Ti is the crucial factor to wet the SiC ceramic. 35 Figure 3D. Moreover, Refs.…”

Section: Gnps Composite Fillermentioning

confidence: 86%

“…The solid phases, however, increased the viscosity of the melt; it restricted the fluidity of melt and caused a final trapezoidal platform. 35,36 Figure 3A shows the interfacial microstructure of SiC/GH99 joint brazed at 860°C for 5 minutes using AgCuTi-1 wt.% GNPs composite filler. The phase compositions of the braze were speculated to be Cu(s,s) (Cu: 95.42 at.%, Ag: 4.58 at.%), Ag(s,s) (Ag: 93.24 at.%, Cu: 6.76 at.%), GNPs + TiC (C: 74.99 at.%, Ti: 25.01 at.%), and TiCuNi 2 (Ni: 51.48 at.%, Cu: 25.05 at.%, Ti: 23.47 at.%) by EDS.…”

Section: Gnps Composite Fillermentioning

confidence: 99%

In‐situ synthesis of TiC nanoparticles during joining of SiC ceramic and GH99 superalloy

et al. 2019

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Molecular dissolution behaviors on porous membrane surface using hierarchical metal–organic framework lamellar membrane

Chen

et al. 2022

AIChE Journal

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Lamellar membranes, especially assembled by microporous framework nanosheets, have excited interest for fast molecular permeation. However, the underlying molecular dissolution behaviors on membrane surface, especially at pore entrances, remain unclear. Here, hierarchical metal-organic framework (MOF) lamellar membranes with 7 nm-thick surface layer and 553 nm-thick support layer are prepared. Hydrophilic (-NH 2 ) or hydrophobic (-CH 3 ) groups are decorated at pore entrances on surface layer to manipulate wettability, while -CH 3 groups on support layer provide comparable, low-resistance paths. We demonstrate that molecular dissolution behaviors are determined by molecule-molecule and molecule-pore interactions, derived from intrinsic parameters of molecule and membrane. Importantly, two dissolution model equations are established: for hydrophobic membrane surface, dissolution activation energy (E S ) obeys E S = K m ln[(γ L -γ C )μd 2 ], while turns to E S =K a ln [(γ L -γ C )δ e μd 2 ] for hydrophilic one. Particularly, hydrophilic pore entrances exert strong interaction with polar molecules, thus compensating the energy consumed by molecule rearrangement, giving fast permeation (>270 L m À2 h À1 bar À1 ).

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Wettability and bonding of graphite by Sn0.3Ag0.7Cu-Ti alloys

Cited by 71 publications

References 50 publications

Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic

Effect of Ti addition on the wetting and brazing of Sn0.3Ag0.7Cu filler on SiC ceramic

In‐situ synthesis of TiC nanoparticles during joining of SiC ceramic and GH99 superalloy

Molecular dissolution behaviors on porous membrane surface using hierarchical metal–organic framework lamellar membrane

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