Wettability and spreading kinetics of liquid aluminium on boron nitride

Xue, X. M.; Wang, J. T.; Quan, M. X.

doi:10.1007/bf02387819

Cited by 27 publications

(7 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…This phenomenon indicates that at higher temperature better wettability is obtained. This trend is consistent with that reported in [7,14].…”

Section: Resultssupporting

confidence: 93%

“…The wetting of a solid by a melt and the subsequent interfacial reactions are essentially involved in a large number of processes such as coating and soldering [1][2][3][4][5]. Studying wetting behavior is important in the characterization of solder alloys and it provides basic physicochemical data for the design and development of composite lead-free solder alloys [6][7][8][9][10][11]. However, systematic investigations into the wetting process of the ternary Sn-30Bi-0.5Cu lead-free solder alloy on different substrates are scarce.…”

mentioning

confidence: 99%

See 1 more Smart Citation

Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

et al. 2011

View full text Add to dashboard Cite

The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K. The triple line frontier, characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H 2 flow. We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K. However, a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K. Our experimental results show a complicated temperature effect on the spreading kinetics. Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu 6 Sn 5 adjacent to the solder and Cu 3 Sn adjacent to the Cu substrate. The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier. In response to concerns over Pb, extensive investigations have been carried out over the last few years to find an acceptable Pb-free solder for various electronic attachment applications. A large number of Pb-free solder alloys have been proposed. The wetting of a solid by a melt and the subsequent interfacial reactions are essentially involved in a large number of processes such as coating and soldering [1][2][3][4][5]. Studying wetting behavior is important in the characterization of solder alloys and it provides basic physicochemical data for the design and development of composite lead-free solder alloys [6][7][8][9][10][11]. However, systematic investigations into the wetting process of the ternary Sn-30Bi-0.5Cu lead-free solder alloy on different substrates are scarce. Cu is one of the most common substrates used in microelectronic devices. Therefore, the general objective of this work is to better understand the wetting process of the Sn30Bi-0.5Cu/Cu system. Materials and methodsSn-30Bi-0.5Cu (wt.%) alloy was prepared by induction melting the alloy powders in a medium-frequency induction furnace (WK-II, Beijing Wuke Photoelectric Technique Co., Ltd., Beijing, China) under an Ar (99.999%) atmosphere followed by casting into copper molds. The alloys were stirred in a quartz crucible for at least 15 min to obtain a homogeneous structure and composition before casting. The sample alloy with an approximate height of 4 mm was used for the wetting experiment and was cut from the as-cast rod that had a diameter of 5 mm. The oxygen-free Cu substrate that was used in the wetting process was cut into 20 mm × 20 mm × 2 mm pieces. Both the alloys and the substrates were polished with SiC paper with an abrasive number of up to 2000 and then cleaned ultrasonically. Wetting experiments were performed by the sessile drop method in an Ar (99.999%)-H 2 (99.999%) flow, which has been described in more detail elsewhere [12,13]. The heat-

show abstract

“…This phenomenon indicates that at higher temperature better wettability is obtained. This trend is consistent with that reported in [7,14].…”

Section: Resultssupporting

confidence: 93%

mentioning

confidence: 99%

Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

et al. 2011

View full text Add to dashboard Cite

show abstract

“…With increasing of the mold temperature, the surface free energy of the inner surface of the copper mold increases, which is helpful to the wetting behavior between the liquid alloy and the mold. [24] In addition, the high mold temperature increases the solidification time of the alloy melt, which is usually favorable to wettability because the liquid alloy has sufficient time to wet and spread on the inner surface of the copper mold. [25][26][27] Sufficient filling with the alloy melt then improves the quality of the cast sample.…”

Section: Discussionmentioning

confidence: 99%

A New Way to Improve Glass‐Forming Ability by Controlling the Preparation Conditions of Bulk Metallic Glass

Mao

Zhang

et al. 2010

Adv Eng Mater

View full text Add to dashboard Cite

More and more amorphous alloys, and their composites, of large size and with extraordinary properties have come forth in the past three decades, greatly promoting the application of amorphous materials. Many researchers have focused on the preparation technology and various preparation techniques have been developed, such as water quenching, copper mold injection/suction casting, mechanical alloying and directional solidification. [1][2][3][4][5][6][7][8] The effects of preparation conditions on the glass forming ability were also studied. [9][10][11][12][13] Generally, there are two aspects to the improvement of glass-forming ability (GFA): i) component optimization, and, ii) modulation and control processing techniques. [14][15][16][17] The latter include repeated melting in vacuum followed by melt purification, new fabrication techniques such as levitation melting and the drop-tube technique, and improved casting process to obtain a higher degree of supercooling and a higher cooling rate. [18][19][20] Here, a new preheating mold temperature method is proposed to improve the GFA using traditional copper mold casting.In general for permanent mold casting, the mold temperature is elevated in order to prolong the service life of the mold and prevent casting defects, such as cold shut, mis-run and gas cavity formation. Because a metal mold has good thermal conductivity, the fluidity of the liquid alloy decreases dramatically in the pouring process. At the same time, a non-preheated metal mold will go through a strong heat shock, resulting in the disadvantages of size imprecision and shortened service life. Solidification of permanent mold casting is dependent on the heat flow from the casting surface, that is, dependent on heat absorption by the permanent mold. The heat absorption of metal-based molds changes with the following factors: the pouring temperature, the mold temperature, the dimensions of casting, the mold thickness, the thermal conductivity of the mold material, and the heat transfer coefficient between the casting and the mold. [21] Changing the mold temperature can influence the solidification process of permanent mold casting. Until now, investigations on the effects of mold preheating temperature on GFA have not been carried out.The aim of this article is to investigate the effects of different mold preheating temperatures on the GFA of two types of Zr-based metallic glass in the copper mold injection-casting method. A new way was proposed to improve the GFA by preheating the mold and the mechanism of improvement is discussed. ExperimentalZr 64.9 Al 7.9 Ni 10.7 Cu 16.5 and Zr 47 Cu 37.5 Ag 7.5 Al 8 alloys were prepared by arc melting appropriate mixtures of Zr, Cu, Al, Ni and Ag, with purities ranging from 99.9% to 99.99%, under a purified argon atmosphere. The ingots were re-melted several times to ensure chemical homogeneity. A measured amount of ingot was re-melted in a quartz tube and heated to the specified temperature, and then immediately injected into one of a range of copper molds having d...

show abstract

“…On the one hand, the nucleation of cBN was restrained because catalysts decreased and AlN formed. On the other hand, the Li-Al-N matrix was formed in Li 3 N-Al-hBN system under HPHT, and it suggests that the viscosity of the molten catalyst increased and the solution of hBN improved because Al has good wettability with hBN [13]. However, when Al content reaches 4 wt%, due to component (Li-Al-N and Li-B-N) and distribution of catalyst being inhomogeneous for viscosity of the molten catalyst increasing (Fig.…”

Section: The Morphology and Size Of Cbn Crystalmentioning

confidence: 95%