Wettability and thermal contact resistance of thermal interface material composited by gallium-based liquid metal on copper foam

Kuang, Hailang; Wu, Bin; Wang, Jingye; Fu, Jingguo; Yang, Feng; Yu, Chen; Wang, Zongyu; Zhang, Jifeng; Ji, Yulong

doi:10.1016/j.ijheatmasstransfer.2022.123444

Cited by 15 publications

(4 citation statements)

References 43 publications

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“…Thermal Interface Materials (TIMs) assume a pivotal role in enhancing heat transfer between heat-generating components and heat sinks, thereby ensuring the overall performance of electronic systems. [6][7][8][9][10] Polymer-based TIMs incorporated with highly thermal-conductive nanofillers, such as BN, [11][12][13][14] graphene 15,16 and SiC 17 are emerging as potential alternatives for ameliorating thermal management issues. Among them, graphene is recognized as one of the best conductive material, thus, graphene-based TIMs often show excellent thermal conductivity even at a low loading.…”

Section: Introductionmentioning

confidence: 99%

“…As electronic devices continue to decrease in size, the efficient dissipation of heat generated within these systems emerges as a critical challenge. Thermal Interface Materials (TIMs) assume a pivotal role in enhancing heat transfer between heat‐generating components and heat sinks, thereby ensuring the overall performance of electronic systems 6–10 …”

Section: Introductionmentioning

confidence: 99%

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Facile preparation of thermally conductive fiber film by self‐assembling interconnected boron nitride nanosheets for effective thermal interface materials

Ye,

Li,

Dai

et al. 2024

Polymer Composites

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Boron nitride (BN) has garnered significant attention for its potential in developing thermally conductive materials owing to its inherent insulating properties and high thermal conductivity. However, achieving high thermal conductivity in bulk materials or 3D structures constructed by BN sheets has remained challenging. In this study, we present a novel approach to design a high‐quality BN fiber using xanthan gum (XG) as a skeleton, aiming to facilitate heat dissipation in integrated circuits. The resulting thermally conductive film, with orderly and compactly arranged BN sheets in the XG skeleton, exhibits a remarkable in‐plane thermal conductivity of 8.26 Wm−1 K−1 and an out‐of‐plane thermal conductivity of 1.35 Wm−1 K−1. This film efficiently enables fast heat dissipation for LED chips and thermoelectric generators. Finite element simulation further supports the efficient heat transfer capacity of the BN fiber films.Highlights A high‐quality BN fiber was prepared by a facile approach. The BN fiber film exhibited high thermal conductivity. This film enables fast heat dissipation in practical applications.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Facile preparation of thermally conductive fiber film by self‐assembling interconnected boron nitride nanosheets for effective thermal interface materials

Ye,

Li,

Dai

et al. 2024

Polymer Composites

View full text Add to dashboard Cite

show abstract

“…Chen et al reported similar results for ZnO/Ag composite substrates, showing excellent sensitivity and the detection limit for another rhodamine dye too. However, in spite of these breakthrough high sensitivities reached with the use of the noble metal/semiconductor composites, the long-term stability and reproducibility are still of great concern in the SERS metrology, , as such, motivating further efforts along this promising direction.…”

Section: Introductionmentioning

confidence: 99%

Sensitive, Stable, and Recyclable ZnO/Ag Nanohybrid Substrates for Surface-Enhanced Raman Scattering Metrology

Samriti,

Kumar,

Kuznetsov

et al. 2024

ACS Mater. Au

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Surface-enhanced Raman scattering is a practical, noninvasive spectroscopic technique that measures chemical fingerprints for varieties of molecules in multiple applications. However, synthesizing appropriate substrates for practical, longterm applications of this method has always been a challenging task. In the present study, we show that ZnO/Ag nanohybrid substrates may act as highly stable, sensitive, and recyclable substrates for surface-enhanced Raman scattering, as illustrated by the detection of methylene blue, selected as a test dye molecule with self-cleaning functionalities. Specifically, we demonstrate the detection enhancement factor of 3.7 × 10 7 along with exceptional long-term stability explained in terms of the localized surface plasmon resonance from the Ag nanocrystals embedded into the chemically inert ZnO nanoparticles, constituting the nanohybrid. Significantly, these substrates can be efficiently cleaned and regenerated while maintaining their high performance upon recycling. As a result, using these substrates, up to 10 −12 M detection sensitivity has been demonstrated, enabling the accuracy required in modern environmental monitoring, bioassays, and analytical chemistry. Thus, ZnO nanoparticles with embedded Ag nanocrystals constitute a novel class of advanced nanohybrid substrates for use in multiple applications of surface-enhanced Raman scattering metrology.

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“…Unfortunately, this strategy often compromises the high thermal conductivity of LM due to the low thermal conductivity of polymers ($0.1 W m À1 K À1 ). [19][20][21][22][23] On the contrary, the incorporation of dopants, in the form of micro-nano inorganic particles (such as Cu, [24][25][26][27] Fe, 28 W, 29 and Ag 30 ), to the LM matrix has been found as a facile strategy to maintain and even improve the thermal conductivity of LM composites. This is due to the thermal conductivity of the incorporated inorganic particles.…”

Section: Introductionmentioning

confidence: 99%

Liquid metal compartmented by polyphenol‐mediated nanointerfaces enables high‐performance thermal management on electronic devices

Zhang

Tang

Guo

et al. 2023

InfoMat

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The exponentially increasing heat generation in electronic devices, induced by high power density and miniaturization, has become a dominant issue that affects carbon footprint, cost, performance, reliability, and lifespan. Liquid metals (LMs) with high thermal conductivity are promising candidates for effective thermal management yet are facing pump‐out and surface‐spreading issues. Confinement in the form of metallic particles can address these problems, but apparent alloying processes elevate the LM melting point, leading to severely deteriorated stability. Here, we propose a facile and sustainable approach to address these challenges by using a biogenic supramolecular network as an effective diffusion barrier at copper particle‐LM (EGaIn/Cu@TA) interfaces to achieve superior thermal conduction. The supramolecular network promotes LM stability by reducing unfavorable alloying and fluidity transition. The EGaIn/Cu@TA exhibits a record‐high metallic‐mediated thermal conductivity (66.1 W m−1 K−1) and fluidic stability. Moreover, mechanistic studies suggest the enhanced heat flow path after the incorporation of copper particles, generating heat dissipation suitable for computer central processing units, exceeding that of commercial silicone. Our results highlight the prospects of renewable macromolecules isolated from biomass for the rational design of nanointerfaces based on metallic particles and LM, paving a new and sustainable avenue for high‐performance thermal management.image

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Wettability and thermal contact resistance of thermal interface material composited by gallium-based liquid metal on copper foam

Cited by 15 publications

References 43 publications

Facile preparation of thermally conductive fiber film by self‐assembling interconnected boron nitride nanosheets for effective thermal interface materials

Facile preparation of thermally conductive fiber film by self‐assembling interconnected boron nitride nanosheets for effective thermal interface materials

Sensitive, Stable, and Recyclable ZnO/Ag Nanohybrid Substrates for Surface-Enhanced Raman Scattering Metrology

Liquid metal compartmented by polyphenol‐mediated nanointerfaces enables high‐performance thermal management on electronic devices

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