Wettability, Interfacial Behavior and Joint Properties 
of Sn-15Bi Solder

Wang, Fengjiang; Ding, Yu Sheng; Liu, Luting; Huang, Ying; Wu, Mingyang

doi:10.1007/s11664-019-07473-3

Cited by 10 publications

(4 citation statements)

References 29 publications

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“…1 To date, extensive research has been actively conducted on Pb-free alloys, particularly focusing on the corrosion resistance, mechanical properties, and physical characteristics of binary, ternary, and multicomponent Pb-free solder alloys like Sn-Cu, Sn-Ag, and Sn-Zn. [2][3][4][5][6][7] Among these, the Sn-Cu series Pb-free alloy emerges as a promising material to replace Pb-based alloys due to its lower cost, reduced melting temperature, enhanced electrical conductivity, and ductility compared with the Sn-Ag and Sn-Zn systems. [8][9][10] Nevertheless, an excess of Cu content in Sn-Cu series Pb-free alloys leads to the formation of coarse crystals, adversely affecting wettability and mechanical strength.…”

Section: Introductionmentioning

confidence: 99%

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

Shenggang,

Yi,

Jihao

et al. 2023

RSC Adv.

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Section: Introductionmentioning

confidence: 99%

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

Shenggang,

Yi,

Jihao

et al. 2023

RSC Adv.

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“…Actual studies compare the quality of the solder joint depending on the type of lead-free solder, most often based on SnAgCu. However, none of these works point to the influence of quality of the PCB´s (Printed Circuit Board) surface finish in relation to the quality of the solder joint, specifically to its resistivity [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Dzivy,

Pietrikova,

Vrublevskaya

et al. 2021

Acta Electrotechnica Et Informatica

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The main purpose of this paper is the analysis of the electrical resistivity of solder joints depending on various surface finishes and on the number of reflow processes. The electrical resistivity was determined after 1, 2, 3, 5 and 6 reflow cycles as a replacement for the basic accelerated aging test. In this article, various surface finishes are compared by measuring electrical resistivity of solder joints between two soldering pads. The influence of standard surface finishes (ENIG, Lead HASL, Lead-free HASL, Cu, ImSn) with the new developed surface finish based on SnAg7 is also compared. Measurements show that the electrical resistivity is dependent on surface finish type and the thickness of the solder joint. The results prove that the new developed surface finish based on SnAg7 is stable against multiple reflows and comparable to the surface finish based on Au. The new developed surface finish based on SnAg7 can be recommended as a replacement for other conventional surface finishes.

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“…In Sn-Bi solder, Bi atoms can also exist as a solid solution in the β-Sn phase, which acts as a solid solution strengthening. Therefore, Sn-Bi solders with lower Bi content, especially Sn-Bi solid solution solders provide potential application to replace Sn-Ag-Cu series solders due to their similar melting point [7,8]. Wang et al [9] investigated the interfacial behavior in Sn-Bi solid solution solder on Cu and found that Sn-Bi solder with low Bi content presented lower growth of intermetallic compound (IMC) thickness and higher joint strength compared with pure Sn solder.…”

Section: Introductionmentioning

confidence: 99%

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

2019

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Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate after thermal aging was investigated. Moreover, to depress the IMC growth at the interface, trace amounts of Zn was added into the Sn-10Bi solder, and the interfacial reactions of Sn-10Bi-xZn solders (x = 0.2, 0.5) and Cu substrate after thermal aging were studied in this paper. Compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding trace amounts of Zn. The addition of 0.2 and 0.5 wt% Zn significantly inhibited the thickness growth of IMCs and the formation of Cu3Sn IMC at the interface of Sn-10Bi-0.2Zn/Cu and Sn-10Bi-0.5Zn/Cu during thermal aging. Therefore, the addition of trace Zn had an obvious effect on the interfacial reaction of Sn-10Bi/Cu solder joint. Interestingly, the evolution of IMC thickness in Sn-10Bi-0.5Zn/Cu solder joints was completely different from that in Sn-10Bi or Sn-10Bi-0.2Zn solder joints, in which the spalling of IMCs occurred. In order to explore the mechanisms on the depressing effect from the addition of trace Zn, the activation energy Q in solder joints during aging was calculated.

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Wettability, Interfacial Behavior and Joint Properties of Sn-15Bi Solder

Cited by 10 publications

References 29 publications

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

Influence of Multiple Reflows and Surface Finishes on Solder Joint Resistivity

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

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