Wettability of Cu-Ti Alloys on Graphite in Different Placement States of Copper and Titanium at 1373 K (1100 °C)

Mao, Weiji; Yamaki, Tomoko; Miyoshi, Noriko; Shinozaki, Nobuya; Ogawa, Toshifumi

doi:10.1007/s11661-015-2803-x

Cited by 19 publications

(4 citation statements)

References 18 publications

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“…According to that study (Scott et al, 1975), the addition of Ti or Cr in Cu alloy can improve the wettability and the bonding force. The similar phenomenon has been reported for the wettability between Cu and graphite by Mao et al (2015). Hence, it can be expected that the addition of Ti particles into the mixed-powder of Cu particles and diamond grains improves bonding force between a diamond grain and Cu matrix.…”

Section: Introductionsupporting

confidence: 83%

“…concentration in the Cu-Ti alloy. Also, Mao et al (2015) have investigated about the wettability of Cu-Ti alloy on graphite plate by melting Cu-Ti alloy on graphite plate, and they have mentioned the formation of TiC layer at interface between Cu-Ti alloy and graphite plate. Therefore, the formation behavior of TiC layer around diamond grain in this study is in good agreement with the results of those previous studies.…”

Section: Microstructural Observation Bonding Tests and Wear Tests Fomentioning

confidence: 99%

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Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method

Sato

Mizuno

Mamiya

et al. 2016

Mechanical Engineering Journal

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As drilling process for carbon fiber reinforced plastic (CFRP), gyro-driving drilling machine has been proposed. Recently, Cu-based diamond grinding wheels for this drilling machine have been fabricated by using centrifugal mixed-powder method (CMPM). However, because diamond abrasive grains in this grinding wheel are dispersed into pure Cu matrix, drop out of the diamond grains occurs due to low wettability between Cu and diamond. In this study, improvement of bonding force between Cu matrix and diamond grains in Cu/diamond composite fabricated by the CMPM is investigated. As improvement method, Ti particles are added into mixed-powder used for the CMPM. This addition of Ti particles forms thin TiC layer at interface between the Cu matrix and the diamond grain. Thickness of the TiC layer increases as the amount of Ti particles in the mixed-powder increases. As the results, the bonding force between the Cu matrix and diamond grains is improved by the addition of Ti particles. The bonding force is increased as Ti concentration in the mixed-powder increases up to 2 mass%. When the Ti concentration exceeds 2 mass%, the bonding force is saturated. Also, the Cu/diamond composite containing Ti makes larger worn groove on counter disc used for wear test comparing with the composite without Ti. Therefore, the addition of Ti particles into the mixed-powder can be expected to enhance grinding ability of Cu-based diamond grinding wheel fabricated by the CMPM.

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Section: Introductionsupporting

confidence: 83%

Section: Microstructural Observation Bonding Tests and Wear Tests Fomentioning

confidence: 99%

Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method

Sato

Mizuno

Mamiya

et al. 2016

Mechanical Engineering Journal

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“…Yang et al revealed that the wettability of Cu-Ti alloys on porous graphite at 1100 • C was closely related to the Ti content and the equilibrium contact angles were dominated by the nature of the reaction layer TiC [17]. Mao et al reported that the wetting spreading of Cu-Ti alloys on graphite at 1100 • C was affected by the contact area between the liquid phase of Cu-Ti alloy and the graphite substrate, as well as the actual contents of Ti in the liquid phase of Cu-Ti alloys [18]. Yang et al investigated the spreading kinetics of Cu-Cr alloys on graphite at 1100 • C and stated that the spreading kinetics was initially chemical reaction controlled and then limited by the diffusion of Cr to the advancing triple line [19].…”

Section: Introductionmentioning

confidence: 99%

Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite

et al. 2020

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In this work, the reactive wetting and infiltration behaviors of a newly designed Sn-V binary alloy were comprehensively explored on porous graphite for the first time. It was discovered that 0.5 wt.% addition of V can obviously improve the wettability of liquid Sn on porous graphite and the nominal V contents in Sn-V binary alloys has minor effects on the apparent contact angles wetted at 950 °C. Moreover, the V-containing Sn-V alloys were initiated to spread on porous graphite at ~650 °C and reached a quasi-equilibrium state at ~900 °C. Spreading kinetics of Sn-3V alloy on porous graphite well fitted in the classic product reaction controlled (PRC) model. However, our microstructural characterization demonstrated that, besides vanadium carbide formation, the adsorption of V element at the wetting three-phase contact line spontaneously contributed to the reactive spreading and infiltrating of Sn-V alloys on porous graphite. Meanwhile, the formation of continuous vanadium carbides could completely block the infiltration of Sn-V active solder alloy in porous graphite. Affected by the growth kinetics of vanadium carbides, the infiltration depth of Sn-V alloys in porous graphite decreased at increased isothermal wetting temperatures. This work is believed to provide implicative notions on the fabrication of graphite related materials and devices using novel V-containing bonding alloys.

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“…The second method is to combine the preparation of TiC x powder and the composite process. The one-step preparation of composite materials can be achieved via in situ reaction [22,23], which can help obtain a high interface bonding strength between the TiC x particles and the matrix metal [24]. Compared with ex situ processing techniques, synthesis approaches based on the in situ formation of particles in metal matrixes offer more possibilities to control the particle size and particle distribution pattern in the composites [25,26].…”

Section: Introductionmentioning

confidence: 99%

Kinetic Models for the in Situ Reaction between Cu-Ti Melt and Graphite

Guo

Wen

Guo

2020

Metals

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The in situ reaction method for preparing metal matrix composites has the advantages of a simple process, good combination of the reinforcing phase and matrix, etc. Based on the mechanism of forming TiC x particles via the dissolution reaction of solid carbon (C) particles in Cu-Ti melt, the kinetic models for C particle dissolution reaction were established. The kinetic models of the dissolution reaction of spherical, cylindrical, and flat C source particles in Cu-Ti melt were deduced, and the expressions of the time for the complete reaction of C source particles of different sizes were obtained. The mathematical relationship between the degree of reaction of C source and the reaction time was deduced by introducing the shape factor. By immersing a cylindrical C rod in a Cu-Ti melt and placing it in a super-gravity field for the dissolution reaction, it was found that the super-gravity field could cause the precipitated TiC x particles to aggregate toward the upper part of the sample under the action of buoyancy. Therefore, the consuming rate of the C rod was significantly accelerated. Based on the flat C source reaction kinetic model, the relationship between the floating speed of TiC x particles in the Cu-Ti melt and the centrifugal velocity (or the coefficient of super-gravity G) was derived. It was proven that, when the centrifugal velocity exceeded a critical value, the super-gravity field could completely avoid the accumulation behavior of TiC x particles on the surface of the C source, thereby speeding up the formation reaction of TiC x . The goal of this study is to better understand and evaluate the generating process of TiC x particles, thus finding possible methods to increase the reaction efficiency

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Wettability of Cu-Ti Alloys on Graphite in Different Placement States of Copper and Titanium at 1373 K (1100 °C)

Cited by 19 publications

References 18 publications

Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method

Improvement of bonding force between abrasive grains and matrix in Cu/diamond composite fabricated by centrifugal mixed-powder method

Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite

Kinetic Models for the in Situ Reaction between Cu-Ti Melt and Graphite

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