Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

Ho, Cheng-Ying; Duh, Jenq‐Gong

doi:10.1016/j.matlet.2012.10.063

Cited by 27 publications

(6 citation statements)

References 15 publications

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“…However, relatively high melting temperature, poor wettability, and fast reaction rate with metallization layer are drawbacks of SAC solders. 3 It is well established that wetting plays a major role in the formation of a metallurgical bond at the soldersubstrate interface, describing the extent of intimate contact between a liquid and solid. 4 The extent of wetting is measured by the contact angle formed at the triple point between the three phases, namely solid, liquid, and vapor, and the substrate surface.…”

Section: Introductionmentioning

confidence: 99%

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Sona

Prabhu

2016

Journal of Elec Materi

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The effect of reflow time on wetting behavior of Sn-2.5Ag-0.5Cu lead-free solder on bare and nickel-coated copper substrates has been investigated. The solder alloy was reflowed at 270°C for various reflow times of 10 s, 100 s, 300 s, and 500 s. On bare copper substrate, the intermetallic compound (IMC) thickness increased with increase in reflow time, whereas on Ni-coated Cu substrate, the IMC thickness increased up to 300 s followed by a drop for solder alloy reflowed for 500 s. The spreading behavior of the solder alloy was categorized into capillary, gravity (diffusion), and viscous zones. Gravity zone was obtained from 3.8 ± 0.43 s to 38.97 ± 3.38 s and from 5.99 ± 0.5 s to 77.82 ± 8.84 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. Sn-2.5Ag-0.5Cu solder alloy was also reflowed for the period corresponding to the end of the gravity zone (40 s and 80 s on bare and Nicoated Cu, respectively). The joint strength was maximum at reflow time of 40 s and 80 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. The dynamic contact angle at the end of the gravity (diffusion) zone (h gz ) was found to be a better parameter compared with the stabilized contact angle (h f ) to assess the effect of the wettability of the liquid solder on the microstructure and joint strength. The present investigation reveals the significance of the gravity zone in assessment of optimum reflow time for leadfree solder alloys.

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Section: Introductionmentioning

confidence: 99%

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Sona

Prabhu

2016

Journal of Elec Materi

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“…Wettability prevents some of the liquid Sn from flowing out of the powder compacts or mechanically alloyed powder agglomerates. Enhancing the wettability of the interfacial intermetallic compound is commonly applied in soldering Sn-base solders on Cu or Ni substrates (Huang and Lin, 2004;Zhang et al, 2011;Ho and Duh, 2013). However, a recent study on solder wettability of Sn/FeNi plated on copper revealed that the wetting force was found to decrease slightly with the growth of a primary FeSn 2 layer at the Sn/FeNi interface .…”

Section: Effect Of Mechanical Alloyingmentioning

confidence: 99%

Fe-Sn Intermetallic Compound Synthesized via Mechanical Alloying and Liquid Phase Sintering

Tosangthum¹,

Meesa-Ard²,

Tongsri³

2017

CMUJNS

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This investigation aimed to synthesize an iron (Fe)-tin (Sn) intermetallic compound (FeSn 2 ) by using a two-step process of mechanical alloying (MA) and liquid phase sintering (LPS). We demonstrated experimentally that this process was able to produce the FeSn 2 intermetallic compound. Two different mechanical alloying procedures for producing mechanically alloyed Fe-Sn powders were explored. In the first, mixtures of as-recieved Fe and Sn powders were mechanically alloyed. In the second, the as-received Fe powder was pre-milled first and the as-received Sn powder was then added and mechanically alloyed. Under the same liquid phase sintering conditions, the sintered materials produced via the first mechanical alloying procedure showed that the FeSn 2 content increased with increasing sintering time and left small traces of unreacted Fe and Sn materials. In the sintered materials produced via the second mechanical alloying procedure, only the FeSn 2 phase was observed for all sintering times. The two-step process using the second mechanical alloying procedure performed better; it synthesized more of the FeSn 2 intermetallic compound.

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“…In recent years, the surface finish of printed circuit boards (PCBs) has attracted more and more attention because of its protective effect on exposed copper circuits and for providing a good soldering surface, which affects the reliability of electronic packaging solder joints [6][7][8]. Compared with common surface finishes such as Organic Solderability Preservative (OSP), Immersion Tin (ImSn), Nickel-Gold (NiAu) and Electroless Nickel/Immersion Gold (ENIG), ENEPIG has the advantages of good thermal stability, high weldability, low cost and no black pad phenomenon, like ENIG [9][10][11][12][13], and can be applied to a variety of packaging forms. The Ni layer in ENEPIG is a widely used barrier material to prevent the rapid generation of brittle IMC from copper in the pad and tin in the solder [14].…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish

Chi

Pan

et al. 2021

Materials

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Electroless Ni(P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in electronic packaging, while the Ni(P) layer increases the impedance of solder joints and leads to signal quality degradation in high-frequency circuits. Reducing the thickness of the Ni(P) layer can balance the high impedance and weldability. In this paper, the interfacial reaction process between ultrathin ENEPIG substrates with different Ni layer thicknesses (0.112 and 0.185 μm) and Sn–3.0Ag–0.5Cu (SAC305) solder during reflow and aging was studied. The bonding ability and reliability of solder joints with different surface finishes were evaluated based on solder ball shear test, drop test and temperature cycle test (TCT), and the failure mechanism was analyzed from the perspective of intermetallic compound (IMC) interface growth. The results showed that the Ni–Sn–P layer generated by ultrathin ENEPIG can inhibit the growth of brittle IMC so that the solder joints maintain high shear strength. Ultrathin ENEPIG with a Ni layer thickness of 0.185 μm had no failure cracks under thermal cycling and drop impact, which can meet actual reliability standards. Therefore, ultrathin ENEPIG has broad prospects and important significance in the field of high-frequency chip substrate design and manufacturing.

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Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn–3.0Ag–0.5Cu solder

Cited by 27 publications

References 15 publications

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates

Fe-Sn Intermetallic Compound Synthesized via Mechanical Alloying and Liquid Phase Sintering

Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish

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