The bonding configuration, hydrogen evolution, and defect content of rapid thermally annealed ͑RTA͒ SiO x :H films of different compositions were studied. Infrared absorption measurements showed that all the hydrogen present in the films is lost at annealing temperatures below 600°C without any change in the oxygen to silicon ratio of the films. The activation energy of the hydrogen release is in the 0.21-0.41 eV range independently of film composition, suggesting that the process occurs via network bond reactions. For annealing temperatures higher than 700°C, a change in the Si-O-Si stretching wave number from the initial unannealed value to the 1070-1080 cm Ϫ1 range was promoted, independently of the initial film composition. Electron spin resonance measurements showed that all the films contain two type of bulk paramagnetic defects: the EЈ center (•SiwO 3 ) and the silicon dangling bond center (•SiwSi 3 ). The RTA process promotes a general decrease of defect concentration for annealing temperatures below 400°C. At higher temperatures, EЈ center disappears, and the •SiwSi 3 center increases its concentration up to the 10 17 -10 18 cm Ϫ3 range. This suggests that the RTA at higher temperatures promotes the formation of a high-quality, almost defect-free, SiO 2 matrix in which highly defective Si nanocrystals are also formed, where the •SiwSi 3 centers are located.