2014
DOI: 10.1007/s10853-013-7983-4
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What is “stationary” deformation of pure Cu?

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Cited by 14 publications
(9 citation statements)
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“…It was found that the creep resistance of the CG and ECAP states is influenced by the type of creep testing. 44) The results demonstrate that UFG Cu tested in tension under constant load exhibits a longer creep live and approximately a similar minimum creep rate as in CG Cu as shown in Fig. 9.…”
Section: Influence Of Testing Modessupporting
confidence: 57%
“…It was found that the creep resistance of the CG and ECAP states is influenced by the type of creep testing. 44) The results demonstrate that UFG Cu tested in tension under constant load exhibits a longer creep live and approximately a similar minimum creep rate as in CG Cu as shown in Fig. 9.…”
Section: Influence Of Testing Modessupporting
confidence: 57%
“…is usually called steady state, stationary state or saturation stage (of flow stress) in the literature. We prefer the term quasi-stationary (qs) state [1], because slow changes of microstructure parameters (boundaries [2,3], particles, . .…”
Section: Introductionmentioning
confidence: 99%
“…The possible mechanisms may be attributed to the recovery of dislocation induced by EPT, which played a crucial role in strengthening the material. [ 34 ] As reported in a previous paper, the decrease of mobile dislocation density leads to an increment in strength and a reduction in ductility when the soften effect induced by grain growth could be ignored. [ 26 ] The TEM image in Figure 7a indicates that the mobile dislocation density of RT‐EPT‐6 sample is lower than that of LN‐EPT‐6 sample in Figure 7b.…”
Section: Discussionmentioning
confidence: 85%