White light interferometric surface profiler

Bowe, Brian

doi:10.1117/1.601727

Cited by 47 publications

(20 citation statements)

References 21 publications

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“…So, it is important to investigate the mechanism of the formation of surface relief gratings depending on recording parameters and physical parameters. These photoinduced surface relief gratings are scanned with a white light interferometer [13,14] after recording. White light interferometry is an extremely powerful technique for surface profile measurement.…”

Section: Introductionmentioning

confidence: 99%

Photoinduced surface relief studies in an acrylamide-based photopolymer

Kotakonda¹,

Naydenova²,

Martin³

et al. 2006

J. Opt. A: Pure Appl. Opt.

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Surface relief gratings (SRGs) have been optically recorded in a dry, selfdeveloping acrylamide-based photopolymer. An investigation of the dependence of photoinduced surface relief amplitude and profile on recording intensity, UV postexposure, thickness of the sample, composition of the photopolymer and temperature at constant spatial frequency was carried out using white light interferometry. Nonsinusoidal surface relief grating profiles which depend on sample thickness were observed at low spatial frequency. The surface relief effect is intended to be applied to the alignment of liquid crystals (LCs) for different applications such as voltage controllable diffraction gratings, lenses, polarizing components and switches.

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Section: Introductionmentioning

confidence: 99%

Photoinduced surface relief studies in an acrylamide-based photopolymer

Kotakonda¹,

Naydenova²,

Martin³

et al. 2006

J. Opt. A: Pure Appl. Opt.

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“…To assess the stress on these silicon dies, we measured the warpage (curvature; out-of-plane displacement) of the die via an optical profilometer. This tool has a capability to scan a wide range of height information (0.1 nm to 500 m) [7].…”

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confidence: 99%

Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches

Walwadkar

Cho

2006

IEEE Trans. Comp. Packag. Technol.

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The device performance of microelectromechanical system (MEMS) inertial sensors such as accelerometers and gyroscopes is strongly influenced by the stress developed in the silicon die during packaging processes. This is due to the die warpage in the presence of the stress. It has previously been shown that most of the stress is generated during a die-attach process. In this study, we employ both experimental and theoretical approaches to gain a better understanding in a stress development induced during the packaging processes of a small silicon die (3.5 3.5 mm 2 ). The former approach is accompanied with an optical profilometer while the latter part by a finite element analysis and an analytical model. A specific emphasis is given to the effects of structural parameters such as the die-attach adhesive thickness and material properties on the stress development. The results from all three approaches show good agreement, in that more compliant and thicker adhesives offer great relief in the stress development, as well as bend the die convex downward from its central location. A stress model proposed from this study not only provides a diagnostic tool for very small stress-sensitive devices, but it will also present a design tool for low-stress MEMS packaging systems.Index Terms-Adhesives, die-attach, die stress, finite element analysis (FEA), microelectromechanical system (MEMS) packaging, profilometer, simulation, warpage.

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“…White-light vertical scanning interferometry can overcome the 2π phase ambiguity problem and extend the field of application of interferometric profilometry to rough surfaces and structured surfaces with large step heights [12][13][14][15][16]. It enables the absolute measurement of the optical path difference (OPD) by determining the peak position from the interferogram.…”

Section: Introductionmentioning

confidence: 99%

Fast surface measurement using wavelength scanning interferometry with compensation of environmental noise

et al. 2010

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We introduce a new optical interferometry system for fast areal surface measurement of microscale and nanoscale surfaces that are immune to environmental noise. Wavelength scanning interferometry together with an acousto-optic tunable filtering technique is used to measure surfaces with large step heights. An active servo control system serves as a phase-compensating mechanism to eliminate the effects of environmental noise. The system can be used for online or in-process measurement on a shop floor. Measurement results from two step height standard samples and a structured surface of a semiconductor daughterboard are presented. In comparison with standard step height specimens, the system achieved nanometer measurement accuracy. The measurement results of the semiconductor daughterboard, under mechanical disturbance, showed that the system can withstand environmental noise.

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White light interferometric surface profiler

Cited by 47 publications

References 21 publications

Photoinduced surface relief studies in an acrylamide-based photopolymer

Photoinduced surface relief studies in an acrylamide-based photopolymer

Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches

Fast surface measurement using wavelength scanning interferometry with compensation of environmental noise

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