2011
DOI: 10.1073/pnas.1100356108
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Whole-Teflon microfluidic chips

Abstract: Although microfluidics has shown exciting potential, its broad applications are significantly limited by drawbacks of the materials used to make them. In this work, we present a convenient strategy for fabricating whole-Teflon microfluidic chips with integrated valves that show outstanding inertness to various chemicals and extreme resistance against all solvents. Compared with other microfluidic materials [e.g., poly(dimethylsiloxane) (PDMS)] the whole-Teflon chip has a few more advantages, such as no absorpt… Show more

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Cited by 200 publications
(188 citation statements)
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“…8 We first fabricated the SU-8 micropattern on silicon wafer, then 500 lm thick PDMS (5:1 weight ratio of components A and B) layer was spin coated onto the pattern, and the PDMS master was fabricated after transferring this fully cured PDMS membrane to glass slide and further cured in a 250 C oven (KSW5-12-A, Zhonghuan Experiment Electric Stove, China) for 1 h. The Teflon FEP plates were thermal molded at 265 C for 5 min using a hot compressor (TM-101F, Taiming, Inc, China). After drilling holes for connection and washing with acetone by sonication, two FEP plates were thermal bonded in the oven (260 C, 1 h).…”
Section: B Teflon Chip Fabricationmentioning
confidence: 99%
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“…8 We first fabricated the SU-8 micropattern on silicon wafer, then 500 lm thick PDMS (5:1 weight ratio of components A and B) layer was spin coated onto the pattern, and the PDMS master was fabricated after transferring this fully cured PDMS membrane to glass slide and further cured in a 250 C oven (KSW5-12-A, Zhonghuan Experiment Electric Stove, China) for 1 h. The Teflon FEP plates were thermal molded at 265 C for 5 min using a hot compressor (TM-101F, Taiming, Inc, China). After drilling holes for connection and washing with acetone by sonication, two FEP plates were thermal bonded in the oven (260 C, 1 h).…”
Section: B Teflon Chip Fabricationmentioning
confidence: 99%
“…46 Generally, non-wetting substrates, such as PE and PTFE, are not favorable for cell adhesion and proliferation. 47 In our previous work, 8 cells adhered to the surface of PFA channels that were pretreated with concentrated sodium hydroxide overnight, which is time consuming with involvement of corrosive reagents. Our above results proved that PDA coating can greatly improve the wetting properties of FEP surface, but the cell viability and activity on PDA-coated FEP channels are still needed to be investigated.…”
Section: E Cell Culturementioning
confidence: 99%
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“…The choice of the materials is made based on the desired properties. Cyclic-olefin copolymer is optically transparent and has low background fluorescence [16]; PMMA is biologically compatible and gas impermeable [17]; FEP has good solvent resistance [18].…”
Section: Technical Aspects Of Droplet Engineeringmentioning
confidence: 99%
“…The second approach has been widely developed since imprint lithography was proposed, such as soft lithography [6] and UV imprint lithography [7][8][9]. By the use of fabricated templates, many complicated micro/nano structures can be replicated in a large variety of materials and in large area efficiently, such as polymethylmethacrylate, ceramics, polystyrene, polyurethane and Teflon [10][11][12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%