2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA) 2014
DOI: 10.1109/ipec.2014.6869846
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Wide-band gap devices in PV systems - opportunities and challenges

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Cited by 26 publications
(20 citation statements)
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“…A detailed description of the PV-inverter hardware implementation has been presented in [9]. The PV-inverter simulation and the laboratory test are performed at the same conditions.…”
Section: Electro-thermal Modelmentioning
confidence: 99%
“…A detailed description of the PV-inverter hardware implementation has been presented in [9]. The PV-inverter simulation and the laboratory test are performed at the same conditions.…”
Section: Electro-thermal Modelmentioning
confidence: 99%
“…The SiC devices can be operated at higher temperatures of ~600 °C without much change in their electrical properties compared with Si devices (~200 °C). The SiC devices are one of the leading candidates of next generation power devices [6][7][8][9][10][11][12][13][14].…”
Section: Introductionmentioning
confidence: 99%
“…Wide bandgap devices, such as Silicon Carbide (SiC) exhibit advantages over Silicon (Si) for power semiconductor applications: higher switching frequency, higher temperature capability, higher power density and higher reliability [1][2][3]. Nowadays, the commercially available power MOSFETs that satisfies the above benefits are with voltage ratings of 400, 650, 900, 1200 and 1700V for both discrete and module packages, and Schottky diodes with ratings up to 8KV [2].…”
Section: Introductionmentioning
confidence: 99%
“…This recent commercialization is expected to have the potential to deliver revolutionary impact on power electronics industry in the future. According to the availability of SiC power MOSFETs on the markets; the main areas that can be utilized by this technology are PV inverter, speed drives, pumps and automotive [3], as well as small-scale wind turbines.…”
Section: Introductionmentioning
confidence: 99%
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